SIM card from an old AT&T cell phone. No vendor logo, die copyright, or other identifying markings whatsoever.

Package

Die carrier

Die

Size is approximately 2000 x 1340 μm (2.68 mm2).

Top layer

The mesh appears pretty weak: one serpentine line zigzagging back and forth with ~850 nm pitch (probably 400-500 nm lines, consistent with the ~180 nm technology node). Since it appears there's only one net there would be no penalty for shorting adjacent lines together, or for cutting out a sizeable area and bypassing it.

Next layer down

HF etched until mesh removal, but not imaged yet.

 
azonenberg/unknown/att_sim.txt · Last modified: 2015/01/04 17:50 (external edit)
 
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