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azonenberg:ti:am1707bzkb3 [2014/03/03 19:16]
azonenberg created
azonenberg:ti:am1707bzkb3 [2015/01/04 22:50] (current)
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-{{tag>collection_az vendor_ti year_unknown type_processor type_processor/microcontroller type_processor/microcontroller/arm foundry_tsmc tech_65nm}}+{{tag>collection_az vendor_ti year_unknown type_processor type_processor/microprocessor type_processor/microprocessor/arm foundry_tsmc tech_65nm}}
  
-TODO+====== Package ====== 
 + 
 +256-ball BGA, 1mm pitch. 
 + 
 +{{:azonenberg:ti:s7303205_cropped.jpg?300|}} 
 + 
 +====== Die ====== 
 + 
 +65 nm 6-metal process. Top layer looks like thick aluminum, lots of long-haul power distribution. 
 + 
 +Size is approximately 5970 x 4370 μm (26.1 mm<sup>2</sup>). 
 + 
 +{{:azonenberg:ti:am1707_bf_neo5x_3k.jpg?600|}} 
 + 
 +Bottom left corner logo. Note "TI" logo upside-down relative to text. 
 + 
 +{{:azonenberg:ti:am1707_25_bf_neo40x_annotated.jpg?300|}} {{:azonenberg:ti:am1707_26_bf_neo40x_annotated.jpg?300|}} 
 + 
 +Nice view of M6 (horizontal thick aluminum), M5 (vertical power routing), M5 (mostly CMP filler here), and M4 (can't see much). 
 + 
 +{{:azonenberg:ti:am1707_27_bf_neo40x_annotated.jpg?300|}} 
 + 
 +Upper left corner alignment markings 
 + 
 +{{:azonenberg:ti:am1707_28_bf_neo40x_annotated.jpg?300|}} 
 + 
 +Damaged bond pad showing underlying layers 
 + 
 +{{:azonenberg:ti:am1707_29_bf_neo40x_annotated.jpg?300|}} 
 + 
 +Test pattern in scribe line 
 + 
 +{{:azonenberg:ti:am1707_32_bf_neo40x_annotated.jpg?300|}}
 
azonenberg/ti/am1707bzkb3.1393874212.txt.gz · Last modified: 2014/03/03 19:16 by azonenberg
 
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