Trace:

This is an old revision of the document!

collection az, vendor nintendo, year 2010, type processor, type processor/microcontroller, type processor/microcontroller/arm, foundry unknown, tech 45nm

SoC from the Nintendo 3DS XL

Package

Markings:

  1226 60
  CPU CTR A
  (M) (C) 2010
  (Nintendo logo)
  JAPAN (ARM logo)

Die

Size is approximately 6640 x 6450 μm (42.8 mm²).

azonenberg/nintendo/3ds_xl_cpu.1395618072.txt.gz · Last modified: 2014/03/23 23:41 by azonenberg

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