This is an old revision of the document!
Package
Markings:
hynix KOR HY27US08561M TPEB 507B M9RB1508?
Last line is in a different font. Firmware revision code maybe?
Die
Size is large (not measured, full images not acquired yet)
Overview of bottom part of die
Closeup of die ID markings
Various parts of memory array (images do not overlap)
Various closeups
Random logic at bottom center of chip. Lots of CMP filler (?)
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