Trace: • cy765631

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Table of Contents

Package
Die
Map

collection az, vendor cypress, year 2005, type interface, type interface/usb, foundry unknown, tech unknown

Package

Die

Size is approximately 2590 x 3400 μm (8.8 mm²)

Map

http://siliconpr0n.org/map/cypress/cy765631/top_metal_bf_neo10x/

azonenberg/cypress/cy765631.1392355689.txt.gz · Last modified: 2014/02/14 05:28 by azonenberg

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