Table of Contents

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Package

Label (top):

Nintendo
RCP-NUS
(M)1996 SGI Nintendo
9905KK035

Die

Size: 9735 x 8082 um

Text:

Nintendo Co., Ltd.
(C) Silicon Graphics, Inc.
(m) 1995 All Rights Reserved
RCP R???0AAA (probably Rev2.0 as HW2 was retail silicon)

There was a mishap during depackaging which created an invisible microfracture. This expanded during ultrasonic cleaning to eventually split the die in two. Additionally, the (remaining?) passivisation does not protect the chip very well as it was not subject to rough treatment yet has numerous scratches. It is unclear if it had another protective layer that was dissolved by the acid bath.

Map

Top metal @ Mit5x: http://siliconpr0n.org/map/nintendo/rcp-nus/mz_cracked_mit5x/

References

See wiki for details about this chip: http://en.wikipedia.org/wiki/RCP_%28chip%29