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- | This page is an index of articles describing procedures in detail, illustrated by photos from contributors' | ||
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- | ====== Decapsulation ====== | ||
- | * [[Tutorial on nitric acid epoxy decapsulation|Epoxy decapsulation for die recovery]] | ||
- | * Heated 70% nitric acid | ||
- | * [[Tutorial on epoxy decapsulation|Epoxy decapsulation for live analysis]] | ||
- | * Heated 70% nitric acid + dropper | ||
- | * [[Tutorial on funneled 70% nitric acid epoxy decapsulation for live analysis using|Epoxy decapsulation for live analysis]] | ||
- | * Heated 70% nitric acid + funnel | ||
- | * [[Tutorial on silver plated copper decapsulation|Silver plated copper decapsulation]] | ||
- | * Isolate the epoxy covered die from the majority carrier | ||
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- | ====== Probing ====== | ||
- | * [[Tutorial on using micropositioners|Using micropositioners]] | ||
- | * Probing ICs for live analysis | ||
- | * [[Tutorial on making bond wire probes|Making bond wire probes]] | ||
- | * Too cheap to buy precision probe tips? Use bond wires | ||
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- | ====== External ====== | ||
- | * [[http:// | ||
- | * RFNA room temperature epoxy decapsulation | ||
- | * [[http:// | ||
- | * Sulphuric acid epoxy decapsulation | ||
- | * [[http:// | ||
- | * RFNA + heat epoxy decapsulation | ||
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