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piranha_solution [2013/11/17 07:03] mcmasterpiranha_solution [2013/11/17 07:08] (current) mcmaster
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   * "spin-on polyimide >17,000 nm/min"   * "spin-on polyimide >17,000 nm/min"
   * "Oxygen plasma eats polyimide at 370nm/min and is "slow or zero" for Cu/Al"   * "Oxygen plasma eats polyimide at 370nm/min and is "slow or zero" for Cu/Al"
 +
 +"The Piranha (also known as sulfuric-peroxide)
 +parts 96% H SO :1 part 30% H O .
 +used here is a mix of
 +. The hydrogen peroxide is added just before use.
 +It is used as a cleaning solution that strips organics and some
 +metals. In these tests, it was indeed found to etch photoresist,
 +the resist pen, and polyimide very rapidly, but only slowly
 +attacked the Parylene C. It also etched aluminum, nickel, and
 +silver rapidly. Chromium was etched slowly, which allows it to
 +be used for the cleaning of photomasks." [Etch rates part II]
  
  
 ====== References ====== ====== References ======
  
-Acid comaptible materials (AMC): http://www.cheresources.com/invision/topic/19132-piranha-caros-acid-peroxymonosulfuric-acid-compatible-materials/+  * Acid comaptible materials (AMC): http://www.cheresources.com/invision/topic/19132-piranha-caros-acid-peroxymonosulfuric-acid-compatible-materials/ 
 +  * [[http://microlab.berkeley.edu/labmanual/chap1/JMEMSEtchRates2(2003).pdf|Etch rates part II]]
  
 
piranha_solution.txt · Last modified: 2013/11/17 07:08 by mcmaster
 
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