This shows you the differences between two versions of the page.
| Both sides previous revisionPrevious revision | Next revisionBoth sides next revision | ||
| decap:ceramic [2018/03/12 04:42] – [Laser] mcmaster | decap:ceramic [2019/12/09 07:30] – [Top heat] mcmaster | ||
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| Above: typical crack due to not pre-heating bottom | Above: typical crack due to not pre-heating bottom | ||
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| + | ===== Bandsaw ===== | ||
| + | |||
| + | DB-100 diamond bandsaw | ||
| + | |||
| + | TLDR: | ||
| + | * Saw a small hole in one side of the cavity above bond wires | ||
| + | * Fill with nail polish to help protect the die against debris | ||
| + | * Slowly side grind and/or cut across the whole cavity | ||
| + | * Cut about halfway through the top ceramic | ||
| + | * You shouldn' | ||
| + | * Wash nail polish away with acetone | ||
| + | * See UV masking page for more info | ||
| ===== Thermal fracture (old) ===== | ===== Thermal fracture (old) ===== | ||