Relevant info on misc chemicals you might encounter. The goal of this page is not to present a comprehensive list of chemicals but rather to highlight some useful chemicals and some key points.
Different chemicals and why you might want them
Delayering: component of standard wet etch. Used as a dillutant in preference over H2O, so vinegar isn't of much use.
General cleaning
Delayering: buffered oxide etching (BOE) buffer salt
Delayering: component of various wet etch solutions
Delayering: Wright etch
Delayering: reduces insoluble products in buffered oxide etching (BOE)
Delayering: component of all wet etches Can be stored in polymethylpentene (PMP), polyethylene (PE), and Teflon (PTFE). [Isotropic Silicon Etching using HF/Nitric/Acetic Acid (HNA)]
HF is notably toxic
See HF for more details
General cleaning
Decapsulation. Info on making: hno3
Delayering: Secco etch
Decapsulation: usually bare die, especially for tough epoxies
Silicon etchant, maybe useful for delayering
TMAH poisoning study https://snf.stanford.edu/SNF/materials-and-chemicals/msds-std-chemicals/liquid/tetramethylammonium-hydroxide-tmah/TMAH.PDF/at_download/file
General cleaning
WARNING: probably the most dangerous chemical you might encounter for this work. Suggest use of fully body protection including gloves, acid gas respirator, and frontal protection. Contact can include causing excruciating pain from dissolving bones, severe burns, cardiac arrest, and more. It may be useful to keep calcium gluconate (2.5% gel) handy to increase chance of survival in case of contact. Seek IMMEDIATE medical attention. It is unknown how over the counter HF from Whink rust remover compares to concentrate in terms of necessary safety precautions.