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| carrier:epoxy [2013/05/05 05:29] – mcmaster | carrier:epoxy [2013/05/05 07:45] – mcmaster | ||
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| * DDM: 4,4 ́ Diaminodiphenyl methane | * DDM: 4,4 ́ Diaminodiphenyl methane | ||
| * DDS: 4,4 ́ Diaminodiphenyl sulfone | * DDS: 4,4 ́ Diaminodiphenyl sulfone | ||
| - | * DETDA: Diethyl toluene diamine | + | * DETDA: Diethyl toluene diamine, CAS 68479-98-1 |
| - | * DGEBA: Diglycidyl ether of bisphenol A | + | * DGEBA: Diglycidyl ether of bisphenol A, CAS 1675-54-3 |
| - | * TETA: Triethylene tetramine Dioctyl phthalate Diglycidylether of 1,4 butane | + | * TETA: Triethylene tetramine Dioctyl phthalate Diglycidylether of 1,4 butane, CAS 112-24-3 |
| - | * TGAP: Triglycidyl p-amino phenol | + | * TGAP: Triglycidyl p-amino phenol, CAS 5026-74-4 |
| * TGDDM: Tetraglycidylether of 4,4′ diaminodiphenyl methane | * TGDDM: Tetraglycidylether of 4,4′ diaminodiphenyl methane | ||
| Line 48: | Line 48: | ||
| | DMC 2000HG | 175 | 26 | | | DMC 2000HG | 175 | 26 | | ||
| - | ===== Additives | + | ===== Composition |
| Many thermoset epoxies contain bromine for flame retardation [Thermoplastics for Packaging 3]. | Many thermoset epoxies contain bromine for flame retardation [Thermoplastics for Packaging 3]. | ||
| + | |||
| + | The following have been observed: | ||
| + | * Epoxy resin | ||
| + | * The specific contents are almost always omitted | ||
| + | * Seen " | ||
| + | * Phenol resin | ||
| + | * The specific contents are almost always omitted, sometimes see " | ||
| + | * Fused silica | ||
| + | * Antimony trioxide | ||
| + | * Carbon black | ||
| + | * Crystalline silica | ||
| + | * Metal hydroxide | ||
| + | * Specific contents always omitted | ||
| Line 115: | Line 128: | ||
| | Metal hydroxide | N/A | 1-10 | | | Metal hydroxide | N/A | 1-10 | | ||
| | Other | N/A | <= 0.5 | | | Other | N/A | <= 0.5 | | ||
| + | |||
| + | |||
| + | ===== Sumikon EME-6600CS ===== | ||
| + | |||
| + | [Sumikon EME-6600CS] | ||
| + | |||
| + | ^ Name ^ CAS ^ Mass % ^ | ||
| + | | Fused silica | 60676-86-0 | 70-90 | | ||
| + | | Epoxy resin | N/A | 8-12 | | ||
| + | | Phenol novolac | 9003-35-4 | 4-7 | | ||
| + | | Antimony trioxide | 1309-64-4 | 1-3 | | ||
| + | | Brominated epoxy resin | 68541-56-0 | 1.6-3.5 | | ||
| + | | Carbon black | 1333-86-4 | 0.1-0.5 | | ||
| + | |||
| + | |||
| + | ===== Hitachi CEL-9200 ===== | ||
| + | |||
| + | [Hitachi CEL-9200] | ||
| + | |||
| + | ^ Name ^ CAS ^ Mass % ^ | ||
| + | | Epoxy resin | 85954-11-6 | 4-6 | | ||
| + | | Phenol resin | 26834-02-6 | 4-6 | | ||
| + | | Brominated epoxy resin | 68541-56-0 | 1 | | ||
| + | | Antimony trioxide | 1309-64-4 | 0.5 | | ||
| + | | Silica | 60676-86-0 | 87-90 | | ||
| + | | Others | N/A | 1 | | ||
| + | |||
| + | |||
| + | ===== Sumikon EME-6710SJ ===== | ||
| + | |||
| + | ^ Name ^ CAS ^ Mass % ^ | ||
| + | | Silica fused | 60676-86-0 | 60-90 | | ||
| + | | Epoxy, cresol novolac | 29690-82-2 | 5-15 | | ||
| + | | Phenol novolac | 9003-35-4 | 3-10 | | ||
| + | | Antimony trioxide | 1309-64-4 | 1-5 | | ||
| + | | Brominated epoxy resin | 68541-56-0 | 1-3 | | ||
| + | | Carbon black | 1333-86-4 | 0.1-0.5 | | ||
| + | |||
| + | Epoxy is Poly[(o-cresyl glycidyl ether)-co-formaldehyde] | ||
| Line 148: | Line 200: | ||
| * ON PCN 16118: http:// | * ON PCN 16118: http:// | ||
| * SI chapter 3: http:// | * SI chapter 3: http:// | ||
| + | * http:// | ||
| + | * Sumikon EME-6600CS: http:// | ||
| + | * Hitachi CEL-9200: http:// | ||
| + | * Sumikon EME-6710SJ: http:// | ||
| + | * SUMITOMO EME-6710S: http:// | ||
| Things to look into: | Things to look into: | ||
| * Characterization of Integrated Circuit Packaging Materials | * Characterization of Integrated Circuit Packaging Materials | ||