Misc:
- CCGA: ceramic column grid array (CGA)
- CGA: column grid array
- CERPACK: ceramic package
- CQGP:
- LLP: Lead Less lead frame Package, a package with metric pin distribution (0.5 mm - 0.8 mm pitch)
- LGA: Land Grid Array
- LTCC: Low temperature co-fired ceramic
- MCM: Multi-Chip Module
- MICRO SMDXT: micro Surface Mount Device extended technology
- MELF: Metal Electrode Leadless Face (usually for resistors and diodes)
- SOD: Small Outline Diode.
- Tape automated bonding (TAB): technique used to feed chips in to a pick n' place
Chip carrier:
- BCC: Bump Chip Carrier
- CLCC: Ceramic Leadless Chip Carrier
- LCC: Leadless Chip Carrier, contacts are recessed vertically.
- LCC: Leaded Chip Carrier
- LCCC: Leaded Ceramic Chip Carrier
- DLCC: Dual Lead-Less Chip Carrier (Ceramic)
- PLCC: Plastic Leaded Chip Carrier
Flat:
- Flatpack, early metal/ceramic case with flat leads
- CFP: Ceramic Flat Pack
- CQFP: ceramic quad flat-pack, similar to PQFP
- BQFP: Bumpered Quad Flat Pack
- DFN: Dual Flat Pack, No Lead
- ETQFP: Exposed Thin Quad Flat Package
- PQFN: power quad flat-pack, no-leads, with exposed die-pad[s] for heatsinking
- PQFP: Plastic quad flat package
- LQFP: Low-profile Quad Flat Package
- QFN: Quad Flat No Leads, also called micro lead frame (MLF)
- Quad Flat Package: (QFP)
- MQFP - Metric Quad Flat Pack,a QFP with metric pin distribution
- HVQFN: Heat-sink very-thin quad flat-pack no-leads
- SIDEBRAZE:
- TQFP: Thin Quad Flat Pack
- TQFN: Thin Quad Flat No-Lead
- VQFB: Very-thin Quad Flat Pack
Small outline:
- CSOP: ceramic SOP
- MSOP: Mini Small-Outline Package
- PSOP: Plastic small-outline package
- QSOP: Quarter-Size Small-Outline package, with pin spacing of 0.635 mm
- SOIC: Small Outline Integrated Circuit (Also SOIC NARROW and SOIC WIDE).
- SOP: Small Outline Package
- SSOP: Shrink Small-Outline Package
- TSOP: Thin Small-outline Package
- TSSOP: Thin Shrink Small Outline Package
- TVSOP: Thin Very Small-Outline Package
- μMAX: Similar to a SOIC. (A Maxim trademark example)
- WSON: Very Very Thin Small Outline No Lead Package
Ball grid array
- FBGA: fine pitch ball grid array, with a square or rectangular array of solder balls on one surface
- LBGA : Low Profile Ball Grid Array (see BGA) (als * Laminate Ball Grid Array)
- TEPBGA: Thermally Enhanced Plastic BGA.
- CBGA: Ceramic Ball Grid Array
- OBGA: Organic Ball Grid Array
- TFBGA - thin fine pitch BGA.
- PBGA: Plastic Ball Grid Array
- UCSP: Similar t * a BGA (A Maxim trademark example)
- μBGA - micro-BGA (Ball grid array), with ball spacing less than 1 mm
- LFBGA - low profile fine pitch ball grid array
- TBGA: Thin Ball Grid Array
- SBGA: Super BGA - above 500 Pin count
- UFBGA: Ultra Fine BGA
Transistor outline (TO):
- TO-3
- TO-5
- TO-18: metal can package with radial leads
- TO-39
- TO-46
- TO-92: plastic encapsulated package with three leads
- TO-99
- TO-100
- TO-220: plastic package with a (usually) metal heat sink tab and three leads
- TO-252
- TO-263
- TO-263 THIN
Small outline transistor (SOT):
- SOT-23
- SOT-223
- SOT-323