Flatpack, early metal/ceramic case with flat leads
CFP: Ceramic Flat Pack
CQFP: ceramic quad flat-pack, similar to PQFP
BQFP: Bumpered Quad Flat Pack
DFN: Dual Flat Pack, No Lead
ETQFP: Exposed Thin Quad Flat Package
PQFN: power quad flat-pack, no-leads, with exposed die-pad[s] for heatsinking
PQFP: Plastic quad flat package
LQFP: Low-profile Quad Flat Package
QFN: Quad Flat No Leads, also called micro lead frame (MLF)
Quad Flat Package: (QFP)
MQFP - Metric Quad Flat Pack,a QFP with metric pin distribution
HVQFN: Heat-sink very-thin quad flat-pack no-leads
SIDEBRAZE:
TQFP: Thin Quad Flat Pack
TQFN: Thin Quad Flat No-Lead
VQFB: Very-thin Quad Flat Pack
CSOP: ceramic SOP
MSOP: Mini Small-Outline Package
PSOP: Plastic small-outline package
QSOP: Quarter-Size Small-Outline package, with pin spacing of 0.635 mm
SOIC: Small Outline Integrated Circuit (Also SOIC NARROW and SOIC WIDE).
SOP: Small Outline Package
SSOP: Shrink Small-Outline Package
TSOP: Thin Small-outline Package
TSSOP: Thin Shrink Small Outline Package
TVSOP: Thin Very Small-Outline Package
μMAX: Similar to a SOIC. (A Maxim trademark example)
WSON: Very Very Thin Small Outline No Lead Package
FBGA: fine pitch ball grid array, with a square or rectangular array of solder balls on one surface
LBGA : Low Profile Ball Grid Array (see BGA) (als * Laminate Ball Grid Array)
TEPBGA: Thermally Enhanced Plastic BGA.
CBGA: Ceramic Ball Grid Array
OBGA: Organic Ball Grid Array
TFBGA - thin fine pitch BGA.
PBGA: Plastic Ball Grid Array
UCSP: Similar t * a BGA (A Maxim trademark example)
μBGA - micro-BGA (Ball grid array), with ball spacing less than 1 mm
LFBGA - low profile fine pitch ball grid array
TBGA: Thin Ball Grid Array
SBGA: Super BGA - above 500 Pin count
UFBGA: Ultra Fine BGA