This page is an index of articles describing procedures in detail, illustrated by photos from contributors' laboratories. The level of background knowledge required may vary and not all tutorials are complete; many are still evolving. [[mcu_security|MCU security series]] ====== Decapsulation ====== * [[Tutorial on nitric acid epoxy decapsulation|Epoxy decapsulation for die recovery]] * Heated 70% nitric acid * [[Tutorial on epoxy decapsulation|Epoxy decapsulation for live analysis]] * Heated 70% nitric acid + dropper * [[Tutorial on silver plated copper decapsulation|Silver plated copper decapsulation]] * Isolate the epoxy covered die from the majority carrier ====== Delayering ====== * [[tutorial:lapping|Using a lapping machine]] ====== Image Analysis ====== * [[Digitizing with Inkscape]] * Manually convert an IC to vector graphics * [[pr0ntools:start|Pr0ntools]] ====== Probing ====== * [[https://microwiki.org/wiki/index.php/Tutorial_on_using_micropositioners|Using micropositioners]] * Probing ICs for live analysis * [[https://microwiki.org/wiki/index.php/Tutorial_on_making_bond_wire_probes|Making bond wire probes]] * Too cheap to buy precision probe tips? Use bond wires. **This article is obsolete, the method described in the article below gives much better results.** * [[https://microwiki.org/wiki/index.php/Tutorial_on_etching_tungsten_probes|Etching tungsten probes]] * This is how most real probe tips are made. ====== External ====== * [[http://travisgoodspeed.blogspot.com/2009/06/cold-labless-hno3-decapping-procedure.html|Cold, Labless HNO3 Decapping Procedure]] by Travis Goodspeed * RFNA room temperature epoxy decapsulation * [[http://microblog.routed.net/2008/07/15/how-to-write-an-ic-friday-post/|HOW TO: write an IC Friday post]] * Sulphuric acid epoxy decapsulation * [[http://www.sparkfun.com/commerce/news.php?id ======384|SparkFun ATmega slug decapsulation]] * RFNA + heat epoxy decapsulation * [[http://blog.dragonsector.pl/2017/10/pwn2win-2017-shift-register.html|pwr2own layout CTF]]