Types:
  * [[carrier:smt|Surface mount technology (SMT)]]
  * [[carrier:th|Through hole]]

====== Generic terms and special packaging ======


===== CERPACK =====

Ceramic package

===== COB (Chip-On-Board) =====

{{gallery>:image:chip_on_board.jpg}}

Bare silicon chip without a package and affixed directly to the circuit board. Use in cost sensitive (ie cheap) applications. Above is probably from a commodity wrist watch.  There seem to be two types:
  * Epoxy blob (below type): die is placed on board, bonded, and then covered with a blob of epoxy.  The most common type
  * Upside down dies (above type): likely WLCSP with underfill.  Basically a BGA where there is no encapsulant on the die and solder balls are attached directly to bond pads (see BGA below for example of this sort of thing)
  * Flexible circuit: these are common in the line drivers on LCD screens

Example showing wire bonding to PCB:

{{gallery>:mcmaster:cob.jpg}}


===== COF (Chip-On-Flex) =====

A variation of COB, where a chip is mounted directly to a flex circuit

===== COG (Chip-On-Glass) =====

A variation of COB, where a chip is mounted directly to a piece of glass - typically an LCD

===== CSP (Chip Scale Package) =====

Package no more than 1.2x the size of the silicon chip.

===== LTCC (Low Temperature Co-fired Ceramic) =====

???

===== MCM (Multi-Chip Module) =====

{{:mcmaster:carrier:mcm_sw206.jpg?300|}}

Several dies integrated into one package.  Considerable variety.


===== Flip chip =====

A package where the die is mounted upside down.  Usually this implies BGA or similar package.

==== Ceramic BGA example ====

Had thermal paste to improve conductivity:

{{:carrier:xpc7455:package_pasted.jpg?300}}

After cleaning:

{{:carrier:xpc7455:package_clean.jpg?300}}

When most solder balls are removed on the bottom looks like this:

{{:carrier:xpc7455:package_bot.jpg?300}}

After dissolving some of the epoxy on the top:

{{:carrier:xpc7455:package_some_top.jpg?300}}
{{:carrier:xpc7455:package_some_side.jpg?300}}

As can see in above though there was still some underfill left.  Next pictures show the epoxy/underfill not completley dissolved and some gunk (solder paste?) left in the center as well as some sort of spacer:

{{:carrier:xpc7455:package_some_nodie.jpg?300}}
{{:carrier:xpc7455:package_some_ga.jpg?300}}

{{:carrier:xpc7455:die_some.jpg?300}}
{{:carrier:xpc7455:die_some_closeup.jpg?300}}


===== MICROARRAY =====

Usually refers to a chip for testing DNA

===== TCSP (True Chip Size Package), TDSP (True Die Size Package) =====


Package is the same size as silicon.

====== References ======

  * http://en.wikipedia.org/wiki/Chip_carrier
  * http://en.wikipedia.org/wiki/List_of_integrated_circuit_packaging_types