Misc:
  * CCGA: ceramic column grid array (CGA)
  * CGA: column grid array
  * CERPACK: ceramic package
  * CQGP:
  * LLP: Lead Less lead frame Package, a package with metric pin distribution (0.5 mm - 0.8 mm pitch)
  * LGA: Land Grid Array
  * LTCC: Low temperature co-fired ceramic
  * MCM: Multi-Chip Module
  * MICRO SMDXT: micro Surface Mount Device extended technology
  * MELF: Metal Electrode Leadless Face (usually for resistors and diodes)
  * SOD: Small Outline Diode.
  * Tape automated bonding (TAB): technique used to feed chips in to a pick n' place
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Chip carrier:
  * BCC: Bump Chip Carrier
  * CLCC: Ceramic Leadless Chip Carrier
  * LCC: Leadless Chip Carrier, contacts are recessed vertically.
  * LCC: Leaded Chip Carrier
  * LCCC: Leaded Ceramic Chip Carrier
  * DLCC: Dual Lead-Less Chip Carrier (Ceramic)
  * PLCC: Plastic Leaded Chip Carrier

Flat:
  * Flatpack, early metal/ceramic case with flat leads
  * CFP: Ceramic Flat Pack
  * CQFP: ceramic quad flat-pack, similar to PQFP
  * BQFP: Bumpered Quad Flat Pack
  * DFN: Dual Flat Pack, No Lead
  * ETQFP: Exposed Thin Quad Flat Package
  * PQFN: power quad flat-pack, no-leads, with exposed die-pad[s] for heatsinking
  * PQFP: Plastic quad flat package
  * LQFP: Low-profile Quad Flat Package
  * QFN: Quad Flat No Leads, also called micro lead frame (MLF)
  * Quad Flat Package: (QFP)
  * MQFP - Metric Quad Flat Pack,a QFP with metric pin distribution
  * HVQFN: Heat-sink very-thin quad flat-pack no-leads
  * SIDEBRAZE:
  * TQFP: Thin Quad Flat Pack
  * TQFN: Thin Quad Flat No-Lead
  * VQFB: Very-thin Quad Flat Pack

Small outline:
  * CSOP: ceramic SOP
  * MSOP: Mini Small-Outline Package
  * PSOP: Plastic small-outline package
  * QSOP: Quarter-Size Small-Outline package, with pin spacing of 0.635 mm
  * SOIC: Small Outline Integrated Circuit (Also SOIC NARROW and SOIC WIDE).
  * SOP: Small Outline Package
  * SSOP: Shrink Small-Outline Package
  * TSOP: Thin Small-outline Package
  * TSSOP: Thin Shrink Small Outline Package
  * TVSOP: Thin Very Small-Outline Package
  * μMAX: Similar to a SOIC. (A Maxim trademark example)
  * WSON: Very Very Thin Small Outline No Lead Package

Ball grid array
  * FBGA: fine pitch ball grid array, with a square or rectangular array of solder balls on one surface 
  * LBGA : Low Profile Ball Grid Array (see BGA) (als  * Laminate Ball Grid Array) 
  * TEPBGA: Thermally Enhanced Plastic BGA.
  * CBGA: Ceramic Ball Grid Array 
  * OBGA: Organic Ball Grid Array 
  * TFBGA - thin fine pitch BGA.
  * PBGA: Plastic Ball Grid Array 
  * UCSP: Similar t  * a BGA (A Maxim trademark example)
  * μBGA - micro-BGA (Ball grid array), with ball spacing less than 1 mm
  * LFBGA - low profile fine pitch ball grid array 
  * TBGA: Thin Ball Grid Array 
  * SBGA: Super BGA - above 500 Pin count 
  * UFBGA: Ultra Fine BGA 

Transistor outline (TO):
  * TO-3
  * TO-5
  * TO-18: metal can package with radial leads
  * TO-39
  * TO-46
  * TO-92: plastic encapsulated package with three leads
  * TO-99
  * TO-100
  * TO-220: plastic package with a (usually) metal heat sink tab and three leads
  * TO-252
  * TO-263
  * TO-263 THIN

Small outline transistor (SOT):
  * SOT-23
  * SOT-223
  * SOT-323


====== References ======

  * http://en.wikipedia.org/wiki/List_of_integrated_circuit_packaging_types