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--- tutorial:lapping [2012/03/19 04:39] – mcmaster
+++ tutorial:lapping [2025/08/04 21:23] (current) – external edit 127.0.0.1
@@ Line 1: / Line 1: @@
+by John McMaster
+-01-20: shot a video, needs to be edited.  Should have some good details
 This tutorial will go through the details of what is needed to setup a lapping machine and basic usage.
+====== Caution ======
+This procedure is going to suggest putting your finger into moving machinery.  This is obviously a good way to break your finger, look at the site disclaimer and be careful.
+This procedure also suggests using cyanide which is deadly.
+I found colloidal silica to be a little irritating the first time I tried it without a lapping machine.  I think this was because I had to apply more pressure to make up for the lack of moving equipment as I didn't have any problems when using the lapping machine.  That said, watch out and consider alternatives if its bothering you.
+====== Why? ======
+Lapping relies on mechanical properties to take a slice out of an IC to show a single layer.  This sort of view can be very intuitive, especially in planarized chips.  Note that non-planarized chips may not give as good as results but it can still be useful.
+Heres an example of what you can get out of non-planarized chips (FIXME: these aren't aligned):
+{{gallery>:tutorial:lapping:sram_top_metal.jpg|}}
+{{gallery>:tutorial:lapping:sram_lapped.jpg|}}
 ====== Setup ======
@@ Line 28: / Line 49: @@
 Collection bottle (don't believe everything you read!)
 {{gallery>:tutorial:lapping:collection_bottle.jpg}}
+====== Sample preparation ======
+The die must have all bond wires removed.  Metal will be difficult to remove and lead to uneven polishing.  Several options:
+  * Mechanically knock the wires off.  Use an inspection scope and a plastic pair of tweezers or two.  Crude but effective.  It will, however, mess up the area around the bonds as you will be ripping up silicon and damage is usually minor but unpredictable
+  * Corrode the bond pads: if they are aluminum, prolonged exposure to H2SO4 or short exposure to dilute HNO3 should eat them away.  Don't wait too long though or you'll eat into the chip
+  * Gold: NaCN can probably be used to remove it cleanly.  Watch out though as cyanide is deadly.  TODO: link to a page on this
 ====== Lapping procedure ======
-Open the stopcock to get solution flowing from the reservoir.  A good rate should be between 1 and 3 drops per second.
+Open the stopcock to get solution flowing from the reservoir.  A good rate should be between 1 and 3 drops per second.  Have it land a little off center, maybe by an inch.
+Get the machine spinning at around 5 or 10 revolutions per second where the solution is landing.  I found slower speeds required excessive pressure to get good results which faster speeds were harder to control and let to more accidents.
+Carefully observe which way the wheel is spinning.  In a short bit you will wan to place you finger on the wheel with a sample such that the wheel is running away from your fingers and maybe an inch diameter further than where the solution is dropping 180 degrees across the wheel.  This will allow it to even out while still being sufficiently wet.
+Wet your finger by placing it on the wheel. Now while its still wet pick up the die with your finger touching the blank side.  The silica will dry a little and should lightly cement it to your finger.  Try to keep it in the center so that pressure is more even.
+Now slowly place it down on the wheel in the position indicated earlier.  Apply very light pressure, what I would more or less consider to be the weight of your finger.  Lap for 30 seconds and then inspect under a microscope.  As you get a better feel for pressure and such you should adjust as timing will likely be very machine specific.
 ====== Tips ======
+Your finger will turn white from contact with the silica.  SiO2 is non-toxic and only and issue if its irritating you skin.  My experience seems to show that irritation probably means you are applying too much pressure.
+{{gallery>tutorial:lapping:finger.jpg}}
+Always wet your finger before picking up a die.  If it falls onto the lapping disk if you are lucky it will safely hit the splash guard.  If you are unlucky it will ricochet across the room and shatter against something hard.  Consider setting up a plastic sheet around the machine to minimize the impact of this if you have a valuable sample or use a jig.
+I have a portable microscope (as opposed to my main which is expensive and weighs several hundred pounds) dedicated for wetwork that makes quickly checking out the sample convenient.
+{{gallery>tutorial:lapping:overview_with_microscope.jpg}}
+If you find it takes you 20 minutes to get through though you are probably either not going fast enough or not applying enough pressure.
+Jigs can be used to take off precision layers but may be overkill for simple analysis.  When CT was asked about them he said he had lapping fixtures but didn't use them.  A lot of his pictures have uneven lapping so hes probably just interested in exposing a single area.  If one wanted full die photographs though they might be a good idea.
 ====== Removing an old disc ======