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invasive [2013/01/22 05:38] – external edit 127.0.0.1invasive [2025/08/04 21:23] (current) – external edit 127.0.0.1
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 ====== Backside analysis ====== ====== Backside analysis ======
  
-Fabs often thin wafers and perform backside analysis to get at the transistors without going through metal.  [Functional IC Analysis] doesn't look like they thinned and they got pretty decent results.+[[backside:start]]
  
 ====== Rewiring ====== ====== Rewiring ======
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 The "professional" high end solution used for small processes.  Equipment is rather expensive. Some estimates seem to put them around an order of magnitude of 500,000 USD. The "professional" high end solution used for small processes.  Equipment is rather expensive. Some estimates seem to put them around an order of magnitude of 500,000 USD.
 +
 +FIB time can often be rented on an hourly basis from universities and research labs.
 +
 +azonenberg is beginning to experiment with FIB. [[azonenberg:fibnotes|Lab notes]]
 +
  
 ==== Scratching ==== ==== Scratching ====
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   * Functional IC Analysis: http://nedos.net/host2012.pdf   * Functional IC Analysis: http://nedos.net/host2012.pdf
 +  * Breaking and Entering through the Silicon: http://nedos.net/ccs2013.pdf
   * Low-Cost Chip Microprobing   * Low-Cost Chip Microprobing
     * http://events.ccc.de/congress/2012/Fahrplan/events/5124.en.html     * http://events.ccc.de/congress/2012/Fahrplan/events/5124.en.html
invasive.1358833090.txt.gz · Last modified: 2013/10/20 14:59 (external edit)