decap:laser
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decap:laser [2025/01/30 03:43] – mcmaster | decap:laser [2025/07/25 18:15] (current) – mcmaster | ||
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===== Epoxy ===== | ===== Epoxy ===== | ||
- | TLDR: bulk material for standard packages can be removed using a fiber laser. However, a CO2 laser will not work (lower peak power => melts silica instead of ablating it). However the laser will damage the die surface if you try to go all the way to the surface (without using a special setup like FALIT). Finally, COB epoxy appears | + | TLDR notes: |
+ | * Fiber: bulk material for standard packages can be removed using a fiber laser (ex: PDIP or COB) | ||
+ | * However the laser will damage the die surface if you try to go all the way to the surface | ||
+ | * CO2 laser will work for COB but not standard packages | ||
+ | * Lower peak power => melts silica instead of ablating it | ||
+ | * "Blue light" systems are slow (hours) but can work on all package types | ||
+ | * Commercial version: FALIT EcoBlue | ||
+ | * Here's some similar research: https:// | ||
+ | * We've also had moderate success locally heating acid with laser, but its not developed enough | ||
Promising results: https:// | Promising results: https:// | ||
+ | * What sort of laser did you use? How did you stop it from obliterating the die? | ||
+ | * Just a cheap laser off AliExpress. 3.5 watt 445nm output. Powerful enough to burn epoxy away (and the bond wires) but not powerful enough to burn silicon. | ||
General results | General results | ||
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Seems to also work | Seems to also work | ||
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+ | ===== McMaster UV tests ===== | ||
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+ | ==== 2025-05-25 ==== | ||
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+ | {{: | ||
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+ | Tried to get Genmitsu unit to see if it would by chance work. 1) too long of wavenlength (probably. 455 nm vs want more 400 nm) 2) came defective | ||
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+ | 2025-07-25 | ||
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+ | going to try this | ||
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+ | https:// | ||
decap/laser.1738208599.txt.gz · Last modified: 2025/01/30 03:43 by mcmaster