decap:epoxy
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| decap:epoxy [2020/02/27 21:02] – [McMaster live 2019-11-10] mcmaster | decap:epoxy [2025/08/04 21:23] (current) – external edit 127.0.0.1 | ||
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| ===== McMaster live 2019-11-10 ===== | ===== McMaster live 2019-11-10 ===== | ||
| - | {{: | + | {{: | 
| Experiments trying to decap COB while keeping PCB intact | Experiments trying to decap COB while keeping PCB intact | ||
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| Above is a compromise between PP providing the best chemical resistance and silicone providing the best seal | Above is a compromise between PP providing the best chemical resistance and silicone providing the best seal | ||
| - | {{: | + | {{: | 
| Above: hardened silicone bubbles on WFNA surface | Above: hardened silicone bubbles on WFNA surface | ||
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| ====== Laser ======  | ====== Laser ======  | ||
| - | General results | + | [[decap: | 
| - | * Some settings work decent | + | |
| - | * Possibly COB epoxy is easier to laser than package epoxy | + | |
| - | * Risk of melting bond wires and/or die | + | |
| - | * Use lower power and/or pulsed? | + | |
| - | * Practice on samples before trying something you care about | + | |
| - | * Puts off nasty fumes. Make sure to have good ventilation | + | |
| - | + | ||
| - | From Sam Wagner: | + | |
| - |   * "We use a yterrbium fiberlaser. What you are doing is trying to cause the plastic compound to explosively eject the silicon beads. So a pulsed laser is critical.  | + | |
| - |   * " | + | |
| - | + | ||
| - | + | ||
| - | ===== jamiecraig ===== | + | |
| - | + | ||
| - | {{: | + | |
| - | + | ||
| - | Above: laser decap from below ([[https:// | + | |
| - | + | ||
| - | https:// | + | |
| - | * Seemed to work okay | + | |
| - | * What would it look like if touched up with WFNA? | + | |
| - | + | ||
| - | ===== EMSL 6502 test ===== | + | |
| - | + | ||
| - | {{:decap:epoxy: | + | |
| - | + | ||
| - | Above: poor results. Maybe from CO2 laser (source: photo by mcmaster from EMSL test) | + | |
| - | + | ||
| - | ===== Silicon Exposed ===== | + | |
| - | + | ||
| - | {{: | + | |
| - | + | ||
| - | Above: [[http:// | + | |
| - | + | ||
| - | http:// | + | |
| - | * Poor results | + | |
| - | * Cranberry glass | + | |
| - | + | ||
| - | ===== Laser Decap Pro ===== | + | |
| - | + | ||
| - | {{: | + | |
| - | + | ||
| - | https:// | + | |
| - | * Gold backing block | + | |
| - | * Good leadframe exposure | + | |
| - | * Die unclear how well exposed | + | |
| - | * Scanned entire chip (including die area) up until the end | + | |
| - | * Raster scan is horizontal, vertical, and diagonal | + | |
| - | + | ||
| - | ===== Sesame 1000 ===== | + | |
| - | + | ||
| - | {{: | + | |
| - | + | ||
| - | {{: | + | |
| - | + | ||
| - | https:// | + | |
| - | * Cavity into pic | + | |
| - | * Gives a close up at the end | + | |
| - | + | ||
| - | ===== CLC ControlLaser FALIT ===== | + | |
| - | + | ||
| - | {{: | + | |
| - | {{: | + | |
| - | {{: | + | |
| - | {{: | + | |
| - | + | ||
| - | https:// | + | |
| - | * Laser Decapsulation FALIT System Software | Image Templates | + | |
| - | * Pro system demo | + | |
| - | * Has nice features like overlaying x-ray, CSAM, or other guiding image | + | |
| - | * Laser scan was horizontal, vertical mix | + | |
| - | + | ||
| - | ===== Light Ray ===== | + | |
| - | + | ||
| - | {{: | + | |
| - | + | ||
| - | https:// | + | |
| - | * They do the whole chip but avoid die area | + | |
| - | * Light Ray - IC Decapsulation | + | |
| - | + | ||
| - | + | ||
| - | ===== mcmaster ezlaze ===== | + | |
| - | + | ||
| - | TODO: add pictures, estimate material removal rate | + | |
| - | Basically this was too slow to be practical except for very small samples. That said, it did work very well. A quicklase or other higher throughput Nd:YAG system would likely work well | ||
| ====== Sandblast ====== | ====== Sandblast ====== | ||
decap/epoxy.1582837330.txt.gz · Last modified: 2020/02/27 21:02 by mcmaster
                
                