Differences

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--- carrier:die_attach [2013/05/01 05:23] – mcmaster
+++ carrier:die_attach [2025/08/04 21:23] (current) – external edit 127.0.0.1
@@ Line 10: / Line 10: @@
   * Epoxy bisphenol
+"Common materials used in packaging...Die bonding" [Plastic MEMS 52]:
+  * Solder alloys
+  * Epoxy resins
+  * Silicone rubber
+Die attach materials [Plastic MEMS 70]:
+  * Polymer: resin based epoxies or polymides
+  * Solder die attach
+  * Gold eutectic die attach
+From datasheets:
+  * Ablestik 8361J [Mindspeed product change note]
+  * CRM-M0209 [Mindspeed product change note]
+  * Ablestik 84-1 LMISR4 [Mindspeed product change note]
+  * Ablestik 3230 [Mindspeed product change note]
+  * Ablestik 8361H [Cypress S32456]
+  * 843J [Hana BOM]
+  * 2200D [Hana BOM]
+  * 2600AT [Hana BOM]
+  * 8290 [Hana BOM]
+  * LE5030 [Hana BOM]
+  * AB2033SC [Hana BOM]
@@ Line 15: / Line 37: @@
   * Study and characterization of plastic encapsulated packages for MEMS (Plastic MEMS): http://www.wpi.edu/Pubs/ETD/Available/etd-01145-144711/unrestricted/thesis-final.pdf
+  * Mindspeed product change note: http://www.mindspeed.com/assets/001/28XXX-PCN-002-A.pdf‎
+  * Cypress S32456: http://smartdata.usbid.com/datasheets/usbid/2001/2001-q1/002605.pdf‎
+  * Hana BOM: http://www.hanagroup.com/pkg_ayt/bom.pdf