infosecdj:st:st1305b
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A small EEPROM memory card with “Secure Logic Access Control”. Has 192 bits on the die. Fabbed at the ST fab in Rousset, FR using the 1500nm CMOS tech node.
Die
Die size: 1.40×1.18 mm approx.
Bonding pad opening: 128.2 um, square.
Metal pitch: 4 um.
Poly pitch: 3.75 um min / 4.5 um typ.
Poly width: 1.5 um min.
ST1305B
(Logo) 1991 (C) (M)
LS SF ML RF OA JJM GC
Top metal imaged under Nikon PlanApo 40x/1.0 oil
- Single (18105×15167, 62.7491MiB)
infosecdj/st/st1305b.1746782561.txt.gz · Last modified: 2025/05/09 09:22 by infosecdj