infosecdj:philips:pcb83c851
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A 8051 derivative.
Package
(Logo) PCB 83C851 P 004 158990 DSD9118V0 Y RTP200 (M)(C) INTEL 1980 (M)(C) PHILIPS 1988
Die
Die size: 5.38×7.58mm approx.
Bonding pad opening: 126 um, square.
Metal pitch: 6.74 um.
Poly pitch: 4.9 um.
Poly width: 2.15 um.
Top metal imaged under a Nikon Plan Apo 20x/0.75
- Single (34622×48767, 394.052MiB)
infosecdj/philips/pcb83c851.1750098162.txt.gz · Last modified: 2025/06/16 18:22 by infosecdj