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PCB 83C851 P 004
158990
DSD9118V0 Y
RTP200
(M)(C) INTEL 1980
(M)(C) PHILIPS 1988

Die size: 5.38×7.58mm approx.

Bonding pad opening: 126 um, square.

Metal pitch: 6.74 um.

Poly pitch: 4.9 um.

Poly width: 2.15 um.

VALVO

V83C851V0

(M)(C) INTEL 1980
(M)(C) PHILIPS 1988

VB
HGA CG
JK AM
JM AK
KA ERM
JD

Top metal imaged under a Nikon Plan Apo 20x/0.75

• Single (34622×48767, 394.052MiB)