(Logo)
PCB 80C652 P 008
084031
D8914V1 YS
346883C652-4N-01
(M)(C) INTEL 1980
(M)(C) PHILIPS 1986

Die size: 5.06×7.52mm approx.

Bonding pad opening: 114 um, square.

Metal pitch: 5.75 um.

Poly pitch: 4.16 um.

Poly width: 2.0 um.

V83C652V1
VALVO
(M)(C) INTEL 1980
(M)(C) PHILIPS 1986

AK CG HS
JK HH HRK
MR SR KK
JM DH DT
HB WS EZ

Top metal imaged under a Nikon Plan Apo 20x/0.75

• Single (32559×48374, 368.37MiB)