TAIWAN
(Logo)
PCB 80C51BH-3 P J521
313060
DSD9436V6 YU
V20810-M7002-B200
(M)(C) INTEL 1980
(M) PHILIPS 1989

Die size: 3.3×3.4mm approx.

Bonding pad opening: 84.8 um, square.

Metal pitch: 4 um.

Poly pitch: 2.86 um.

Poly width: 1.3 um.

(M)(C) INTEL 1980
(M) PHILIPS

V80C51BV6

VALVO

Top metal imaged under a Nikon Plan Apo 40x/1.0 oil

• Single (42745×43518, 443.734MiB)

ILD remains + poly imaged under a Nikon Plan Apo 40x/1.0 oil

• Single (42773×43563, 351.664MiB)

Poly imaged under a Nikon Plan Apo 40x/1.0 oil

• Single (42351×43581, 287.697MiB)