(Logo)
P83C562EFA 503
369340
DfD9548V2 Y
730 429-00
(M)(C) INTEL 1980
(M)(C) PHILIPS 1994

Die size: 3.9×3.8mm approx.

Bonding pad opening: 89 um, square.

Metal pitch: 3.16 um.

Poly pitch: 2.27 um.

Poly width: 1.0 um.

V83C562V2

(M)(C) INTEL 1980
(M)(C) PHILIPS 1994

Top metal imaged under a Nikon Plan Apo 40x/1.0 oil

• Single (50870×50236, 526.444MiB)