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A foundry is an IC fabrication facility.
Processes C18 @ 0.18 µm H18 @ 0.18 µm C35B4C3 @ 0.35 µm C35B4M3 @ 0.35 µm C35B4O1 @ 0.35 µm H35B4D3 @ 0.35 µm S35D4 @ 0.35 µm
BAE Systems Information and Electronic Systems Integration, Inc. (Manassas, VA) BAE Systems Micrwave Electronics Center Nashua (Nashua, NH)
Acquired by Global Foundries in 2010 0.13 µm 300 mm wafers
Dongbu 90 nm to 0.35 um “Dongby HiTek's broad and deep semiconductor expertise encompasses High Voltage (HV), Application-Specific Integrated Circuit (ASIC), CMOS Image Sensor (CIS), Digital Signal Processor (DSP), Microcontroller Unit (MCU), and Non-Volatile Memory (e-Flash) devices.”
Processes
0.13-micron to 40nm
28nm and below
Processes
Processes
Honeywell Aerospace Plymouth (Plymouth, MN)
HRL Labratories LLC
Malibu, CA
Main article
Palm Bay. FL
Processes
Processes
Processes
Foundries
0.25 um - 0.14 um 200 mm and 300 mm wafers
Nortrup Grumman Electronic Systems (Blatimore, MD) Northrup Grumman Space Technology (Redondo Beach, CA)
Processes
Processes
Andower, MA
Processes
300 mm wafers
Princeton, NJ
0.35 um to 90nm
Produces ICs for many third parties include such large organizations as nVidia. TODO: image some nVidia chips to see if we can capture some identifying marks. Processes
Processes
Israel: 6” and 8”
US: 8”
China “manufacturing partnerships”
“silicon germanium (SiGe) bipolar complementary metal-oxide semiconductor (BiCMOS), silicon BiCMOS, digital CMOS, analog CMOS and RF CMOS technologies”
TriQuint Semiconductor Texas (Richardson, TX)
Processes
0.18um to 0.5um
8“ wafers
“CMOS; 1.0 - 0.18 µm modular mixed-signal CMOS technologies. BiCMOS; 0.6 µm technology. SOI-CMOS; 0.6 µm & 1.0 µm CMOS and BCD technology on SOI substrates. MEMS Technologies. CUSP”
1. http://www.mosis.com/products/fab/schedule/ 2. http://www.jazzsemi.com/fact-sheets.html 3. http://www.national.com/vcm/NSC_Content/Files/en_US/Milaero/TrustedFoundryOverview.pdf 4. http://www.mosis.com/db/pubf/fsched?ORG=ON-SEMI 5. http://www.mosis.com/db/pubf/fsched?ORG=AMS 6. http://www.mosis.com/db/pubf/fsched?ORG=PEREGRINE 7. http://www.interfacebus.com/semiconductor_wafer_foundry.html 8. http://www.globalfoundries.com/services/global_shuttle.aspx 9. http://www.globalfoundries.com/manufacturing/300mm.aspx 10. http://www.globalfoundries.com/manufacturing/200mm.aspx 11. http://www.umc.com/English/process/index.asp 12. http://en.wikipedia.org/wiki/Semiconductor_Manufacturing_International_Corporation 13. http://www.dongbu.com/eng/product/product_list.asp?idx=2 14. http://www.vis.com.tw/english/b_services/b02_services.htm 15. http://www.samsung.com/global/business/semiconductor/products/strategicfoundry/Products_ProcessTechnology.html 16. http://www.gracesemi.com/Website/eWebEditor/Roadmap2010_new_big.jpg 17. http://www.hjtc.com.cn/aboutHJ/PressRelease.asp 18. http://www.hhnec.com/EN/Technology/index.aspx 19. http://www.ssmc.com.sg/technology_portfolio.asp 20. http://www.ti.com/research/docs/TI_ManufacturingStrategy_WP.pdf 21. http://www.magnachip.com/eng/product/foundry/proc_portfolio.jsp