digshadow:nintendo:rcp-nus
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Table of Contents
Package
Die
Size: 9735 x 8082 um
Text:
There was a mishap during depackaging which created an invisible microfracture. This expanded during ultrasonic cleaning to eventually split the die in two.
Map
References
See wiki for details about this chip: http://en.wikipedia.org/wiki/RCP_%28chip%29
digshadow/nintendo/rcp-nus.1369531873.txt.gz ยท Last modified: 2013/05/26 01:31 by digshadow