This shows you the differences between two versions of the page.
azonenberg:xilinx:xc6slx4 [2015/01/04 22:50] |
azonenberg:xilinx:xc6slx4 [2015/01/04 22:50] (current) |
||
---|---|---|---|
Line 1: | Line 1: | ||
+ | {{tag> | ||
+ | |||
+ | ====== Package ====== | ||
+ | |||
+ | 144-pin TQFP supplied on cut tape. Die revision B. | ||
+ | |||
+ | Markings (top side): | ||
+ | XILINX(R) | ||
+ | SPARTAN(R)-6 | ||
+ | XC6SLX4(TM) | ||
+ | TQG144BIV1209 | ||
+ | D4371643A | ||
+ | 2C | ||
+ | |||
+ | {{: | ||
+ | |||
+ | ====== CAD floorplan ====== | ||
+ | |||
+ | From PlanAhead. | ||
+ | |||
+ | {{: | ||
+ | |||
+ | ====== Die ====== | ||
+ | |||
+ | Samsung 45nm process. | ||
+ | |||
+ | Passivation was somewhat damaged due to overly aggressive cleaning. | ||
+ | |||
+ | Overview | ||
+ | |||
+ | {{: | ||
+ | |||
+ | Bond pads and test points | ||
+ | |||
+ | {{: | ||
+ | |||
+ | Die logo | ||
+ | |||
+ | {{: | ||
+ | |||
+ | Damaged passivation (from cleaning) | ||
+ | |||
+ | {{: | ||
+ | |||
+ | x1 metal layer (probably M5 and M6) in SEM: | ||
+ | |||
+ | {{: | ||
+ | |||
+ | {{: | ||
+ | |||
+ | {{: | ||
+ | |||
+ | ====== Map ====== | ||
+ | |||
+ | [[http:// | ||