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azonenberg:xilinx:xc3s50an [2014/02/04 21:28]
azonenberg
azonenberg:xilinx:xc3s50an [2015/01/04 17:50] (current)
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 ====== Package ====== ====== Package ======
  
-{{:​azonenberg:​xilinx:​dscf4617_cropped.jpg?​300|}}+{{:​azonenberg:​xilinx:​dscf4617_cropped.jpg?300|}} {{:​azonenberg:​xilinx:​dscf4752_cropped.jpg?300|}}
  
 Label: Label:
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 Device was decapped in-package with 68% HNO3 on 1/29/2014 by lab group A of CSCI 4974/6974 at RPI. Note leadframe damage and bond wires with one end floating; the floating bond wires were easily bent by a short blast of compressed air. Device was decapped in-package with 68% HNO3 on 1/29/2014 by lab group A of CSCI 4974/6974 at RPI. Note leadframe damage and bond wires with one end floating; the floating bond wires were easily bent by a short blast of compressed air.
  
-{{:​azonenberg:​xilinx:​dscf4752_cropped.jpg?300|}}+{{:​azonenberg:​xilinx:​xc3s50an_01_bf_sz.jpg?600|}}
  
-{{:​azonenberg:​xilinx:​xc3s50an_01_bf_sz.jpg?300|}}+{{:​azonenberg:​xilinx:​xc3s50an_03_bf_sz.jpg?600|}}
  
-{{:​azonenberg:​xilinx:​xc3s50an_03_bf_sz.jpg?​300|}} +{{:​azonenberg:​xilinx:​xc3s50an_04_bf_sz.jpg?​600|}}
- +
-{{:​azonenberg:​xilinx:​xc3s50an_04_bf_sz.jpg?​300|}}+
  
 ====== Flash die ====== ====== Flash die ======
 
azonenberg/xilinx/xc3s50an.txt · Last modified: 2015/01/04 17:50 (external edit)
 
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