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azonenberg:xilinx:xc3s50an [2014/02/05 02:28] azonenberg |
azonenberg:xilinx:xc3s50an [2015/01/04 22:50] |
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- | SRAM+Flash hybrid FPGA contains an XC3S50A die from Xilinx and an Atmel DataFlash die wire-bonded together. | ||
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- | The die ID code of the FPGA (X8701) matches the regular XC3S50A. | ||
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- | Full-die imagery of the FPGA was not acquired because the die is identical to the regular XC3S50A, which has already been imaged. | ||
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- | ====== Package ====== | ||
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- | (X) XILINX (R) | ||
- | SPARTAN (R) | ||
- | XC3S50AN (TM) | ||
- | TQG144AGQ1341 | ||
- | D4631772A | ||
- | 4C | ||
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- | Device was decapped in-package with 68% HNO3 on 1/29/2014 by lab group A of CSCI 4974/6974 at RPI. Note leadframe damage and bond wires with one end floating; the floating bond wires were easily bent by a short blast of compressed air. | ||
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- | ====== Flash die ====== | ||
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- | ====== FPGA die ====== | ||
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- | The FPGA die is covered by an overcoat which can be scratched off with a scalpel blade but does not respond to acid. Possibly some sort of polyimide? | ||
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