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azonenberg:xilinx:xc2c32a [2014/02/03 22:11] azonenberg [Die overview (metal 4)] |
azonenberg:xilinx:xc2c32a [2015/01/04 22:50] |
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- | 180nm 4-metal process. | ||
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- | ====== Package ====== | ||
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- | CPG56 - 0.5mm chip-scale BGA. | ||
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- | Markings: | ||
- | [Xilinx logo] 2C32A | ||
- | F40731-1049 | ||
- | PHILIPPINES | ||
- | C4-AMS 6C | ||
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- | ====== Die overview (metal 4) ====== | ||
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- | Die size: 1895 x 1710 μm (3.24 mm^2) | ||
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- | ====== Floorplan (metal 4) ====== | ||
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- | ====== Plan view closeups (metal 4) ====== | ||
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- | ===== Die logo ===== | ||
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- | ===== Output bus from function block 2 macrocells to I/O bank 1 ===== | ||
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- | ===== Copyright notice (upside-down in bottom left corner) ===== | ||
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- | ===== VCCIO junction ===== | ||
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- | Junction between VCCIO1 (left) and VCCIO2 (right) at bottom center of die. Note vias from ground ring to ground pad at bottom. | ||
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- | ===== ZIA wiring ===== | ||
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- | ====== Maps ====== | ||
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- | ====== Cross sections ====== | ||
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