This shows you the differences between two versions of the page.
| Both sides previous revision Previous revision | |||
|
azonenberg:ti:drv2605 [2013/12/23 06:49] azonenberg |
azonenberg:ti:drv2605 [2013/12/23 06:54] azonenberg |
||
|---|---|---|---|
| Line 3: | Line 3: | ||
| I2C controlled haptic motor driver packaged in a 3x3 ball 0.5mm WLCSP. | I2C controlled haptic motor driver packaged in a 3x3 ball 0.5mm WLCSP. | ||
| - | This chip was removed from a PCB which had been damaged during assembly and would otherwise have been scrapped; there is a small amount of flux residue on the underside as a result. One corner of the die was slightly chipped during removal from the PCB. | + | This chip was removed from a PCB which had been damaged during assembly and would otherwise have been scrapped; there is a small amount of flux residue on the underside as a result. |
| + | |||
| + | One corner of the die was slightly chipped during removal from the PCB. | ||
| No decap was required; the top metal layer is visible through the polyimide overcoat simply by looking at the bottom side of the packaged device. | No decap was required; the top metal layer is visible through the polyimide overcoat simply by looking at the bottom side of the packaged device. | ||