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azonenberg:ti:am1707bzkb3 [2014/03/19 05:51] azonenberg |
azonenberg:ti:am1707bzkb3 [2015/01/04 22:50] |
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- | ====== Package ====== | ||
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- | 256-ball BGA, 1mm pitch. | ||
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- | ====== Die ====== | ||
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- | 65 nm 6-metal process. Top layer looks like thick aluminum, lots of long-haul power distribution. | ||
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- | Size is approximately 5970 x 4370 μm (26.1 mm< | ||
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- | Bottom left corner logo. Note " | ||
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- | Nice view of M6 (horizontal thick aluminum), M5 (vertical power routing), M5 (mostly CMP filler here), and M4 (can't see much). | ||
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- | Upper left corner alignment markings | ||
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- | Damaged bond pad showing underlying layers | ||
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- | Test pattern in scribe line | ||
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