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azonenberg:ti:am1707bzkb3 [2014/03/19 05:51]
azonenberg
azonenberg:ti:am1707bzkb3 [2015/01/04 22:50]
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-{{tag>collection_az vendor_ti year_unknown type_processor type_processor/microprocessor type_processor/microprocessor/arm foundry_tsmc tech_65nm}} 
  
-====== Package ====== 
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-256-ball BGA, 1mm pitch. 
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-{{:azonenberg:ti:s7303205_cropped.jpg?300|}} 
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-====== Die ====== 
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-65 nm 6-metal process. Top layer looks like thick aluminum, lots of long-haul power distribution. 
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-Size is approximately 5970 x 4370 μm (26.1 mm<sup>2</sup>). 
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-{{:azonenberg:ti:am1707_bf_neo5x_3k.jpg?600|}} 
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-Bottom left corner logo. Note "TI" logo upside-down relative to text. 
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-{{:azonenberg:ti:am1707_25_bf_neo40x_annotated.jpg?300|}} {{:azonenberg:ti:am1707_26_bf_neo40x_annotated.jpg?300|}} 
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-Nice view of M6 (horizontal thick aluminum), M5 (vertical power routing), M5 (mostly CMP filler here), and M4 (can't see much). 
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-{{:azonenberg:ti:am1707_27_bf_neo40x_annotated.jpg?300|}} 
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-Upper left corner alignment markings 
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-{{:azonenberg:ti:am1707_28_bf_neo40x_annotated.jpg?300|}} 
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-Damaged bond pad showing underlying layers 
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-{{:azonenberg:ti:am1707_29_bf_neo40x_annotated.jpg?300|}} 
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-Test pattern in scribe line 
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-{{:azonenberg:ti:am1707_32_bf_neo40x_annotated.jpg?300|}} 
 
azonenberg/ti/am1707bzkb3.txt · Last modified: 2015/01/04 22:50 (external edit)
 
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