Differences

This shows you the differences between two versions of the page.

Link to this comparison view

Both sides previous revision Previous revision
Next revision
Previous revision
Next revision Both sides next revision
azonenberg:microchip:23k256 [2014/04/08 07:16]
azonenberg
azonenberg:microchip:23k256 [2014/04/08 07:26]
azonenberg
Line 3: Line 3:
 SPI serial SRAM chip. Looks like 4 metal layers and a fairly fine process geometry. SPI serial SRAM chip. Looks like 4 metal layers and a fairly fine process geometry.
  
-Definitely //not// one of Microchip's standard fan processes. CMP filler pattern is consistent with UMC 180 nm (pitch and dimensions of CMP filler and traces on both M4 and M3 match [[azonenberg:xilinx:xc2c32a]] within 3%). Die logo etc also do not match the normal Microchip layout.+Definitely //not// one of Microchip's standard fan processes. CMP filler pattern is consistent with UMC 180 nm (pitch and dimensions of CMP filler and traces on both M4 and M3 match [[azonenberg:xilinx:xc2c32a]] within 3%) however this is the only evidence we have to support this conclusion at this time; tag is tentative. 
 + 
 +The die ID also does not match the normal Microchip layout and there is no Microchip logo on the die. Maybe this mask set was acquired from a buyout or something? 
 + 
 +There are three unbonded pads on the die. Purpose of these is unknown at this time since all known packages are 8 pins.
  
 ====== Package ====== ====== Package ======
 
azonenberg/microchip/23k256.txt · Last modified: 2015/01/04 22:50 (external edit)
 
Except where otherwise noted, content on this wiki is licensed under the following license: CC Attribution 4.0 International
Recent changes RSS feed Donate Powered by PHP Valid XHTML 1.0 Valid CSS Driven by DokuWiki