Package
Die
| Step | Notes |
|---|---|
| mz | 1) Laser back off 2) HCl + 12% H2O2 15 min, 90C 3) WFNA, 10 min |
| s1-1 | 48% HF, 11 min, 25C |
| s1-2 | Barrier etch (4.5 mL 35% H2O2, 1 mL NH4OH), 3 min, 90C |
| s1-3 | 48% HF, 10 min, 25C |
| s1-4 | 1 mL 48% HF, 1 mL H3PO4, 1 mL H2SO4, 30 min, 90C |
- Single (13344×12424, 50.001MiB)
- Single (13336×12416, 61.21MiB)
- Single (13360×12424, 73.4101MiB)
- Single (13360×12416, 73.1764MiB)
- Single (13280×12400, 72.0861MiB)
- Single (4017×7565, 5.32457MiB)
- Single (10083×8571, 12.0209MiB)
- Single (11094×11233, 26748300B)
- Single (10999×14549, 29.9137MiB)
