A small EEPROM memory card with “Secure Logic Access Control”. Has 192 bits on the die. Fabbed at the ST fab in Rousset, FR using the 1500nm CMOS tech node.
Datasheet: https://www.alldatasheet.com/datasheet-pdf/pdf/22202/STMICROELECTRONICS/ST1305B.html
Die
Die size: 1.40×1.18 mm approx.
Bonding pad opening: 128.2 um, square.
Metal pitch: 4 um.
Poly pitch: 3.75 um min / 4.5 um typ.
Poly width: 1.5 um min.
Text features on the die:
ST1305B
(Logo) 1991 (C) (M)
LS SF ML RF OA JJM GC
Top metal imaged under Nikon PlanApo 40x/1.0 oil
- Single (18105×15167, 62.7491MiB)
Poly+diffusuon imaged under Nikon PlanApo 40x/1.0 oil
- Single (18131×15199, 51.6819MiB)
