A 8051 derivative.
Package
TAIWAN (Logo) PCB 80C51BH-3 P J521 313060 DSD9436V6 YU V20810-M7002-B200 (M)(C) INTEL 1980 (M) PHILIPS 1989
Die
Die size: 3.3×3.4mm approx.
Bonding pad opening: 84.8 um, square.
Metal pitch: 4 um.
Poly pitch: 2.86 um.
Poly width: 1.3 um.
(M)(C) INTEL 1980 (M) PHILIPS
V80C51BV6
VALVO
Top metal imaged under a Nikon Plan Apo 40x/1.0 oil
- Single (42745×43518, 443.734MiB)
ILD remains + poly imaged under a Nikon Plan Apo 40x/1.0 oil
- Single (42773×43563, 351.664MiB)
Poly imaged under a Nikon Plan Apo 40x/1.0 oil
- Single (42351×43581, 287.697MiB)
