A 8051 derivative.
Package
(Logo) P83C562EFA 503 369340 DfD9548V2 Y 730 429-00 (M)(C) INTEL 1980 (M)(C) PHILIPS 1994
Die
Die size: 3.9×3.8mm approx.
Bonding pad opening: 89 um, square.
Metal pitch: 3.16 um.
Poly pitch: 2.27 um.
Poly width: 1.0 um.
V83C562V2
(M)(C) INTEL 1980 (M)(C) PHILIPS 1994
Top metal imaged under a Nikon Plan Apo 40x/1.0 oil
- Single (50870×50236, 526.444MiB)
