, , , ,

Reportedly made using a 5-metal-layers 130nm process at FAB25.

Package

CY8C2412PVI-432
2307 B 04
CYP 603898
C

Die

(C) 2012
8C44200A
(Logo)

siliconprawn.org_map_cypress_cy8c4124pvi_single_cypress_cy8c4124pvi_infosecdj_mz_nikpa40x.thumb.jpg

Top metal imaged using Nikon Plan Apo 40x/1.0 oil