TODO: move this to individual vendors if it becomes comprehensive enough ====== AD ====== ===== Ceramic ===== Based off of data from Materials Declaration of 8L CerDIP: http://www.analog.com/static/imported-files/packages/39260738806786CerDIP_8.pdf ^ Assembly ^ Component ^ Material ^ % component ^ % Assembly % ^ % package ^ | Base | Ceramics | Al2O3 | | 62.11 | 20.36 | | | | MnO2 | | 2.38 | 0.78 | | | | SiO2 | | 2.02 | 0.66 | | | | TiO2 | | 1.28 | 0.42 | | | | Cr2O3 | | 1.01 | 0.33 | | | | Fe2O3 | | 0.82 | 0.27 | | | | MgO | | 0.37 | 0.12 | | | | CaO | | 0.03 | 0.01 | | | | Co3O4 | | 0.18 | 0.06 | | | Sealing glass | PbO | | 13.28 | 4.35 | | | | SnO2 | | 3.48 | 1.14 | | | | SiO2 | | 1.56 | 0.51 | | | | B2O3 | | 8.12 | 2.66 | | | | Al2O3 | | 0.92 | 0.30 | | | | TiO2 | | 1.28 | 0.42 | | | | MgO | | 0.46 | 0.15 | | | | ZnO | | 0.18 | 0.06 | | | | CaO | | 0.46 | 0.15 | | | | Cr2O3 | | 0.03 | 0.009 | | | | Fe2O3 | | 0.03 | 0.009 | | | | MnO2 | | 0.009 | 0.003 | | | | Na2O | | 0.002 | 0.0006| | Lid | Ceramics | Al2O3 | | 62.59 | 31.33 | | | | MnO2 | | 2.40 | 1.20 | | | | SiO2 | | 2.00 | 1.00 | | | | TiO2 | | 1.30 | 0.65 | | | | Cr2O3 | | 1.00 | 0.50 | | | | Fe2O3 | | 0.80 | 0.40 | | | | Co3O4 | | 0.20 | 0.10 | | | | MgO | | 0.40 | 0.20 | | | | CaO | | 0.03 | 0.02 | | | Sealing glass | PbO | | 17.90 | 8.96 | | | | SnO2 | | 4.60 | 2.30 | | | | SiO2 | | 2.20 | 1.10 | | | | B2O3 | | 1.70 | 0.85 | | | | Al2O3 | | 1.20 | 0.60 | | | | MgO | | 0.70 | 0.35 | | | | CaO | | 0.70 | 0.35 | | | | ZnO | | 0.20 | 0.10 | | | | Cr2O3 | | 0.04 | 0.02 | | | | Fe2O3 | | 0.04 | 0.02 | | | | MnO2 | | 0.01 | 0.005 | | Misc | Leadframe | Fe | | 58.405| 7.01 | | | | Ni | | 40.883| 4.90 | | | | Mn | | 0.521 | 0.06 | | | | Si | | 0.130 | 0.02 | | | | Co | | 0.030 | 0.004 | | | | Cr | | 0.010 | 0.001 | | | | Al | | 0.010 | 0.001 | | | | S | | 0.006 | 0.0007| | | | C | | 0.003 | 0.0004| | | | P | | 0.002 | 0.0002| | | Paste | Ag | | 80 | 0.80 | | | | Pb-borate glass | | 20 |0.20 | | | Chip | Si | | 100 | 0.06 | | | Bonding wires | Al | | 100 | 0.10 | | | Solder | Sn | | 63 | 2.52 | | | | Pb | | 37 | 1.48 | ====== Altera ====== Uses amkor, see http://www.altera.com/literature/pcn/pcn0702.pdf ====== Cypress ====== ===== 32.45-lead Plastic Small Outline Package (SOIC) ===== http://smartdata.usbid.com/datasheets/usbid/2001/2001-q1/002605.pdf‎ * Package Designation: S32456 * Package Outline, Type, or Name: 32-lead Plastic Small Outline IC (SOIC) * Mold Compound Name/Manufacturer: NITTO MP8000CH4-A2 * Mold Compound Flammability Rating: V-O per UL94 * Oxygen Rating Index: >28% * Lead Frame Designation: S * Lead Frame Material: Copper * Lead Finish, Composition / Thickness: Solder Plated 85%Sn - 15% Pb) * Die Backside Preparation Method/Metallization: N/A * Die Separation Method: Wafer Saw * Die Attach Supplier: Ablestik * Die Attach Material: Ablestik 8361H * Bond Diagram Designation 10-03242 * Wire Bond Method: Gold Wire Bonding * Wire Material/Size: Gold/ 1.30mil * Thermal Resistance Theta JA °C/W: 56 * Package Cross Section Yes/No: N/A * Assembly Process Flow: 11-21000M * Name/Location of Assembly (prime) facility: Cypress Philipines (CSPI-R) ====== Fox ====== ===== XpressO 3.2x2.5mm Ceramic ===== Based off of data from http://www.foxonline.com/pdfs/materialdeclarations/XpressO%203225%20Materials.pdf ^ Assembly ^ Component ^ Material ^ % component ^ % package ^ | Cover | Kovar | Ni | | 3.70 | | | | Co | | 2.16 | | | | Fe | | 6.80 | | | Ni plating | Ni | | 0.73 | | | | P | | 0.08 | | Base | Ceramic | Al2O3 | 90.13 | 11.69 | | | | SiO2 | 6.40 | 6.40 | | | | 0.45 | 3.47 | 3.47 | | | | Total | 100.0 | 12.97 | | | Metalization | W | | 8.07 | | | | Mo | | 0.42 | | | Ni plating | Ni | 42.47 | 0.31 | | | | Co | 57.53 | 0.42 | | | Au plating | Au | 100 | 0.75 | | | Seal ring | Fe | | 6.74 | | | | Ni | | 3.62 | | | | Co | | 2.12 | | | Ag solder | Ag | | 2.41 | | | | Cu | | 0.42 | | IC | IC | Al | | 0.125 | | | | Si | | 1.919 | | | Au | Au | | 0.333 | | | Adhesive | Ag | | 0.708 | | | | Phenolic resin | | 0.062 | | | | Epoxy resin | | 0.062 | | Crystal | Crystal | SiO2 | | 2.91 | | | Electrode | Ag | | 0.0491 | | | | Cr | | 0.0008 | | | Adhesive | Ag | | 0.083240 | | | | Si | | 0.016648 | ====== HANA Microelectronics group ====== http://www.hanagroup.com/pkg_ayt/bom.pdf Sample of packages to include all epoxy and die attach materials ^ Package ^ Green? (ie RHoS) ^ Die attach (conductive) ^ Die attach (non-conductive) ^ Mold compound ^ | PDIP | N | 84-1LMISR4 | 843J | EME6300HR, EME6600CR | | PDIP | Y | 2200D | 2200D | G600 | | SOIC | N | 84-1LMISR4 | 843J | MP8000AN/CH | | SOIC | Y | 2200D | 2200D | G600 | | MSOP | N | 84-1LMISR4 | 843J | MP8000AN/CH4 | | MSOP | Y | 2200D | 2200D | G600 | | MSOP (clear) | N | N/A | N/A | MG97-8006A | | SOT89 | N | 84-1LMISR4 | 843J | MP8000AN/CH | | SOT89 | Y | 2600AT | 2600AT | CEL9220HF10 | | SOT223 | N | 84-1LMISR4 | 843J | MP8000CH | | SOT223 | Y | 8290 | 8290 | G600 | | SOT5x3 | N | N/A | N/A | MP8000AN | | SOT5x3 | Y | 2200D | LE5030 | KMC3580P14F | | LGA | N | 84-1LMISR4 | 843J | N/A | | LGA | Y | AB2033SC | AB2033SC | CEL9220HF13H | | LGA | N | 84-1LMISR4 | 843J | EME6710S | ====== Maxim ====== http://www.maximintegrated.com/emmi/msds.cfm ====== Microchip ====== http://ww1.microchip.com/downloads/en/EnvironmentalInformation/Material%20Content%20Declarations_MCDg.pdf ====== Mindspeed ====== http://www.mindspeed.com/assets/001/28XXX-PCN-002-A.pdf‎ Product change notification that describes switch from Skyworks to Amkor encapsulation provider. ====== Skyworks ====== http://www.skyworksinc.com/ [[http://www.mindspeed.com/assets/001/28XXX-PCN-002-A.pdf‎|Mindspeed product change note]] * Mold compound: Sumitomo 6650E * Die Attach: Ablestik 8361J * Lead Frame: Cu 194 * Lead Coating: 85/15 Sn/Pb * Wire: 1.25 mil Au * Marking: Ink [[http://www.mindspeed.com/assets/001/28XXX-PCN-002-A.pdf‎|Mindspeed product change note]] * Mold compound: Sumitomo 7351LS * Die Attach: CRM-M0209 * Lead Frame: Cu 194 * Lead Coating: 85/15 Sn/Pb * Wire: 1.25 mil Au * Marking: Ink ====== Amkor ====== http://www.amkor.com/ ===== Altera PROCESS CHANGE NOTIFICATION PCN0702 UPDATE ===== http://www.altera.com/literature/pcn/pcn0702.pdf ^ Package ^ Mold material ^ Site ^ | PQFP | Sumitomo EME 6300HJ | Philippines | | PQFP | Sumitomo G700M | Philippines | | PDIP non-Pb free | Sumitomo EME 6300H | Philippines | | PDIP non-Pb free | Sumitomo G600 | Philippines | | PDIP Pb free | DongJin DMC 2000HG | Philippines | | PDIP Pb free | Sumitomo G600 | Philippines | | RQFP | Sumitomo EME-6300H | Korea | | RQFP | Nitto MP8000CH4 | Korea | | RQFP | Sumitomo G700M | Korea | ===== Mindspeed product change note ===== http://www.mindspeed.com/assets/001/28XXX-PCN-002-A.pdf‎ Selected packages 80 pin PQFP * Mold compound: Nitto MP8000CH4 * Die Attach: Ablestik 8361J * Lead Frame: Cu 194 * Lead Coating: 85/15 Sn/Pb * Wire: 1.0 mil Au * Marking: Ink 128 pin LQFP * Mold compound: Sumitomo 7320CR * Die Attach: Ablestik 84-1 LMISR4 * Lead Frame: Cu 194 * Lead Coating: 85/15 Sn/Pb * Wire: 1.0 mil Au * Marking: Ink 128 pin LQFP * Mold compound: Sumitomo EME-G700L * Die Attach: Ablestik 3230 * Lead Frame: Cu 194 * Lead Coating: 85/15 Sn/Pb * Wire: 1.0 mil Au * Marking: Ink ====== ST ====== ===== CerDIP ===== Based on ST chemical content of semiconductor packaging: http://uk.farnell.com/images/en_UK/rohs/pdf/st-chemicals.pdf, page 72 ^ Component ^ Overall material ^ Material ^ % component ^ % package ^ | Base | Alumina | Al2O3 | | 30.85 | | | | SiO2 | | 3.43 | | Cup | Alumina | Al2O3 | | 30.85 | | | | SiO2 | | 3.43 | | Leadframe |Alloy 42| Fe | | 7.64 | | | | Ni | | 5.54 | | Sealing glass |Silicates| PbO | | 9.79 | | | | SiO2 | | 1.57 | | | | Misc | | 7.11 | | Chip (doped Si) | | Si | | 0.44 | | | | Al | | 0.0026| | Die bonding |Ag glass| Ag | | 0.048 | | | | Pb | | 0.003 | | | | Misc | | 0.009 | | Wires (Al) | | Al | | 0.04 | | Leadfinishing | Sn | Sn | | 0.30 | ===== PDIP (standard) ===== Based on ST chemical content of semiconductor packaging: http://uk.farnell.com/images/en_UK/rohs/pdf/st-chemicals.pdf, page 86 ^ Component ^ Overall material ^ Material ^ % component ^ % package ^ | Leadframe|Cu alloy, Ag plating| Cu | | 27.40 | | | | Fe | | 0.65 | | | | P | | 0.028 | | | | Ag | | 0.028 | | Encapsulation | Epoxy resin | SiO2 | | 49 | | | | Epoxy | | 19 | | | | Sb2O3 | | 1.4 | | | | Br (TBBA) | | 0.7 | | Chip | Doped Si | Si | | 0.994 | | | | Al | | 0.006 | | Die bonding | Glue | Ag | | 0.038 | | | | Epoxy resin | | 0.013 | | Wires | Au | Au | | 0.15 | |Leadfinishing (Non-RoHS?)| Sn/Pb|Sn | | 0.42 | | | | Pb | | 0.28 | |Leadfinishing (RoHS?)|Sn | Sn | | 0.7 | ===== PDIP (power) ===== Based on ST chemical content of semiconductor packaging: http://uk.farnell.com/images/en_UK/rohs/pdf/st-chemicals.pdf, page 88. This is similiar to above except has heavier leadframe and solders the die to the leadframe instead of gluing for better thermal conductivity ^ Component ^ Overall material ^ Material ^ % component ^ % package ^ | Leadframe|Cu alloy, Ag plating| Cu | | 45.53 | | | | Fe | | 1.07 | | | | P | | 0.047 | | | | Ag | | 0.047 | | Encapsulation | Epoxy resin | SiO2 | | 35.70 | | | | Epoxy | | 13.77 | | | | Sb2O3 | | 1.02 | | | | Br (TBBA) | | 0.51 | | Chip | Doped Si | Si | | 0.994 | | | | Al | | 0.006 | | Die bonding |Soft solder| Pb | | 0.300 | | | | Sn | | 0.016 | | | | Ag | | 0.0048| | Wires | Au | Au | | 0.25 | |Leadfinishing (Non-RoHS?)| Sn/Pb|Sn | | 0.62 | | | | Pb | | 0.11 | |Leadfinishing (RoHS?)|Sn | Sn | | 0.73 | ====== Xilinx ====== [[:vendor:xilinx:package]]