{{tag>collection_mcmaster vendor_raspberry-pi type_unknown year_2020 foundry_tsmc}}

Chip is from RP2040 (Raspberry Pi Pico). [[https://twitter.com/johndmcmaster/status/1355092011829719046|More images here]]

====== Package ======

{{:mcmaster:raspberry-pi:rp2-b0:pack_top.jpg?300|}}

<code>
RP2-B0 20/34
P64M15.OQ TTT
</code>

{{:mcmaster:raspberry-pi:rp2-b0:pack_btm.jpg?300|}}

<code>
</code>

====== Die ======

<code>
RP2 B0 2020(C)

M8 R0
M7 R0
V6 B0
</code>

[[https://siliconpr0n.org/map/raspberry-pi/rp2-b0/mcmaster_mz_mit20x/|mz_mit20x]]

    * [[https://siliconpr0n.org/map/raspberry-pi/rp2-b0/single/raspberry-pi_rp2-b0_mcmaster_mz_mit20x.jpg|Single]] (4861x4721, 8171000B)

[[https://siliconpr0n.org/map/raspberry-pi/rp2-b0/mcmaster_s1-9_mit20x/|s1-9_mit20x]]

    * [[https://siliconpr0n.org/map/raspberry-pi/rp2-b0/single/raspberry-pi_rp2-b0_mcmaster_s1-9_mit20x.jpg|Single]] (4932x4798, 7180040B)

[[https://siliconpr0n.org/map/raspberry-pi/rp2-b0/mcmaster_s1-9_vc60x/|s1-9_vc60x]]

    * [[https://siliconpr0n.org/map/raspberry-pi/rp2-b0/single/raspberry-pi_rp2-b0_mcmaster_s1-9_vc60x.jpg|Single]] (14876x14436, 38.8783MiB)


^ Process step  ^ Process                                        ^ Notes                                                                                                                      ^
| s1-1          | 2 min 20% hf\\ 2 min hcl/h2o2                  | minor corrosion on top metal                                                                                               |
| s1-2          | 2 min 20% hf\\ 1 min hcl/h2o2\\ 2 min barrier  |                                                                                                                            |
| s1-3          | 3 min 20% hf\\ 2 min barrier\\ 4 min hcl/h2o2  | misc process issues causing unintended times\\ significant top metal erosion of some sort\\ see stringers floating around  |
| s1-4          | 3 min 20% hf\\ 2 min hcl/h2o2\\ 4 min barrier  | significant erosion into oxide\\ looks like maybe some wax residue on die?\\ Gentle IPA scrub w/ foam tip removed it       |
| s1-5          | 2 min 20% hf\\ 2 min hcl/h2o2\\ 4 min barrier  | much more etching\\ lots of transistors exposed\\ keep going at this cadence\\ scrubbed die again to remove residue        |
| s1-6          | 2 min 20% hf\\ 2 min hcl/h2o2\\ 4 min barrier  |                                                                                                                            |
| s1-7          | 2 min 20% hf\\ 2 min hcl/h2o2\\ no barrier     | Getting close to done\\ No barrier and no residue\\ Barrier etch must be eating wax                                        |
| s1-8          | 2 min 20% hf\\ 2 min hcl/h2o2\\ no barrier     | getting close to done                                                                                                      |
| s1-9          | 2 min 20% hf\\ 2 min hcl/h2o2\\ no barrier     | Very small oxide left\\ Call it good enough                                                                                |