{{tag>collection_infosecdj vendor_philips type_processor_microcontroller_8051 year_1994 foundry_unknown}} A 8051 derivative. ====== Package ====== {{:infosecdj:philips:p83c562efa:pack_top.jpg?300|}} (Logo) P83C562EFA 503 369340 DfD9548V2 Y 730 429-00 (M)(C) INTEL 1980 (M)(C) PHILIPS 1994 ====== Die ====== Die size: 3.9x3.8mm approx. Bonding pad opening: 89 um, square. Metal pitch: 3.16 um. Poly pitch: 2.27 um. Poly width: 1.0 um. V83C562V2 (M)(C) INTEL 1980 (M)(C) PHILIPS 1994 {{https://siliconpr0n.org/map/philips/p83c562efa/single/philips_p83c562efa_infosecdj_mz_nikpa40x.thumb.jpg}} [[https://siliconpr0n.org/map/philips/p83c562efa/infosecdj_mz_nikpa40x/|Top metal imaged under a Nikon Plan Apo 40x/1.0 oil]] * [[https://siliconpr0n.org/map/philips/p83c562efa/single/philips_p83c562efa_infosecdj_mz_nikpa40x.jpg|Single]] (50870x50236, 526.444MiB)