{{tag>collection_infosecdj vendor_philips type_processor_microcontroller_8051 year_1994 foundry_unknown}}
A 8051 derivative.
====== Package ======
{{:infosecdj:philips:p83c562efa:pack_top.jpg?300|}}
(Logo)
P83C562EFA 503
369340
DfD9548V2 Y
730 429-00
(M)(C) INTEL 1980
(M)(C) PHILIPS 1994
====== Die ======
Die size: 3.9x3.8mm approx.
Bonding pad opening: 89 um, square.
Metal pitch: 3.16 um.
Poly pitch: 2.27 um.
Poly width: 1.0 um.
V83C562V2
(M)(C) INTEL 1980
(M)(C) PHILIPS 1994
{{https://siliconpr0n.org/map/philips/p83c562efa/single/philips_p83c562efa_infosecdj_mz_nikpa40x.thumb.jpg}}
[[https://siliconpr0n.org/map/philips/p83c562efa/infosecdj_mz_nikpa40x/|Top metal imaged under a Nikon Plan Apo 40x/1.0 oil]]
* [[https://siliconpr0n.org/map/philips/p83c562efa/single/philips_p83c562efa_infosecdj_mz_nikpa40x.jpg|Single]] (50870x50236, 526.444MiB)