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package:materials

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package:materials [2013/05/05 02:56] – mcmasterpackage:materials [2025/08/04 21:24] (current) – external edit 127.0.0.1
Line 66: Line 66:
 |                 | Solder        | Sn      |       | 63    | 2.52  | |                 | Solder        | Sn      |       | 63    | 2.52  |
 |                 |               | Pb      |       | 37    | 1.48  | |                 |               | Pb      |       | 37    | 1.48  |
 +
 +
 +====== Altera ======
 +
 +Uses amkor, see http://www.altera.com/literature/pcn/pcn0702.pdf
 +
  
 ====== Cypress ====== ====== Cypress ======
Line 156: Line 162:
 | LGA | Y | AB2033SC | AB2033SC | CEL9220HF13H | | LGA | Y | AB2033SC | AB2033SC | CEL9220HF13H |
 | LGA | N | 84-1LMISR4 | 843J | EME6710S | | LGA | N | 84-1LMISR4 | 843J | EME6710S |
 +
 +
 +====== Maxim ======
 +
 +http://www.maximintegrated.com/emmi/msds.cfm
  
  
Line 193: Line 204:
 http://www.amkor.com/ http://www.amkor.com/
  
-[[http://www.mindspeed.com/assets/001/28XXX-PCN-002-A.pdf‎|Mindspeed product change note]], 80 pin PQFP+===== Altera PROCESS CHANGE NOTIFICATION PCN0702 UPDATE ===== 
 + 
 +http://www.altera.com/literature/pcn/pcn0702.pdf 
 + 
 +^ Package ^ Mold material ^ Site ^ 
 +| PQFP | Sumitomo EME 6300HJ | Philippines | 
 +| PQFP | Sumitomo G700M | Philippines | 
 +| PDIP non-Pb free | Sumitomo EME 6300H | Philippines | 
 +| PDIP non-Pb free | Sumitomo G600 | Philippines | 
 +| PDIP Pb free | DongJin DMC 2000HG | Philippines | 
 +| PDIP Pb free | Sumitomo G600 | Philippines | 
 +| RQFP | Sumitomo EME-6300H | Korea | 
 +| RQFP | Nitto MP8000CH4 | Korea | 
 +| RQFP | Sumitomo G700M | Korea | 
 + 
 + 
 +===== Mindspeed product change note ===== 
 + 
 +http://www.mindspeed.com/assets/001/28XXX-PCN-002-A.pdf‎ 
 + 
 +Selected packages 
 + 
 +80 pin PQFP
   * Mold compound: Nitto MP8000CH4   * Mold compound: Nitto MP8000CH4
   * Die Attach: Ablestik 8361J   * Die Attach: Ablestik 8361J
Line 201: Line 234:
   * Marking: Ink   * Marking: Ink
  
-[[http://www.mindspeed.com/assets/001/28XXX-PCN-002-A.pdf‎|Mindspeed product change note]], 128 pin LQFP+128 pin LQFP
   * Mold compound: Sumitomo 7320CR   * Mold compound: Sumitomo 7320CR
   * Die Attach: Ablestik 84-1 LMISR4   * Die Attach: Ablestik 84-1 LMISR4
Line 209: Line 242:
   * Marking: Ink   * Marking: Ink
  
-[[http://www.mindspeed.com/assets/001/28XXX-PCN-002-A.pdf‎|Mindspeed product change note]], 128 pin LQFP+128 pin LQFP
   * Mold compound: Sumitomo EME-G700L   * Mold compound: Sumitomo EME-G700L
   * Die Attach: Ablestik 3230   * Die Attach: Ablestik 3230
package/materials.1367722584.txt.gz · Last modified: 2013/05/05 02:56 by mcmaster