Differences

This shows you the differences between two versions of the page.

--- mcmaster:hp:hp-c5_1fi1-0001 [2014/12/27 08:27] – mcmaster
+++ mcmaster:hp:hp-c5_1fi1-0001 [Unknown date] (current) – removed - external edit (Unknown date) 127.0.0.1
@@ Line 1: / Line 1: @@
-{{tag>collection_mcmaster vendor_hp type_unknown year_unknown tech_unknown foundry_unknown}}
-====== System ======
-From HP logic analyzer
-{{:mcmaster:hp:hp-c5_1fi1-0001:pcb.jpg?300|}}
-====== Package ======
-{{:mcmaster:hp:hp-c5_1fi1-0001:pack1.jpg?300|}}
-{{:mcmaster:hp:hp-c5_1fi1-0001:pack2.jpg?300|}}
-Heatsink label:
-<code>
-HP-C5 1FI1-0001
-USA 10/87
-</code>
-The package itself looks like it might have an "E" stamped on it but otherwise no markings
-====== Die ======
-Somewhat unusual, the die does not have any overglass.  Instead, it had an (epoxy?) protective coat on it.
-The top metal is greenish.  My theory is that its related to copper traces left from removing the copper slug.  H2SO4 was used to do final decap kept at very high concentration due to the very small amount of epoxy.  Primarily its intent was to dissolve the die attach epoxy.
-[[http://siliconpr0n.org/map/hp/hp-c5_1fi1-0001/top_metal_mit20x/|Top metal @ mit20x]]
-  * [[http://siliconpr0n.org/map/hp/hp-c5_1fi1-0001/single/hp_hp-c5_1fi1-0001_top_metal_mit20x.jpg|Single]] (17587x18687, 113MB)