Differences

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--- mcmaster:atmel:at89c52 [2016/01/15 15:59] – created mcmaster
+++ mcmaster:atmel:at89c52 [2025/05/18 00:26] (current) – external edit 127.0.0.1
@@ Line 11: / Line 11: @@
 ====== Die ======
-[[https://siliconpr0n.org/map/atmel/at89c52/mz_mit20x/|MZ @ mit20x]]
+{{:mcmaster:atmel:at89c52:die.jpg?300|}}
-  * [[https://siliconpr0n.org/map/atmel/at89c52/single/atmel_at89c52_mz_mit20x.jpg|Single]] (33 MB, 12803x7849)
+[[https://siliconpr0n.org/map/atmel/at89c52/mcmaster_mz_mit20x/|MZ @ mit20x]]
+  * [[https://siliconpr0n.org/map/atmel/at89c52/single/atmel_at89c52_mcmaster_mz_mit20x.jpg|Single]] (33 MB, 12803x7849)
+I went to ultrasound it to try to clean it up and it tore up the pads.  I used 9 WFNA : 1 H2SO4 for decap.  Straight WFNA may have been less gentle on the package but more gentle on the pads.  Maybe only use 91 if the leadframe gets exposed or copper wires (which should be fine if WFNA remains concentrated anyway).