Differences

This shows you the differences between two versions of the page.

--- mcmaster:ami:781400 [2021/05/28 02:34] – external edit 127.0.0.1
+++ mcmaster:ami:781400 [2023/02/08 02:40] (current) – removed mcmaster
@@ Line 1: / Line 1: @@
-{{tag>collection_mcmaster vendor_unknown type_unknown year_unknown foundry_unknown tech_unknown}}
-====== Package ======
-{{:digshadow:ami:781400:pack_top.jpg?300|}}
-{{:digshadow:ami:781400:pack_bot.jpg?300|}}
-Top:
-<code>
-AMI
--115XX
--001
-KOREA
-</code>
-====== Die ======
-Label:
-<code>
-</code>
-===== Damage =====
-The back attach was very difficult to get off.  It was cooked in WFNA for 30 minutes in an attempt to release it.  In retrospect, this was too long of a period and caused the WFNA to dilute, resulting in minor corrosion.  It would have been better to do a 24 hour cold soak.
-After cooking with no effect, I gave up and was going to try to gently remove it.  After only very light handling, chunks started to come out of the back.  I immediately stopped trying to remove it and instead went to lightly pick it up to deposit into a vial.  The die then fractured from the tweezer pressure.
-There appears to be a scratch pre-dating the other damage (given that its corroded).  It is unclear where this came from.
-The die is quite dirty since I was not able to safely ultrasonic clean it.  Now that its been imaged, if there is desire for a cleaner image, I could try to clean it better but it may shatter.
-====== Map ======
-[[http://siliconpr0n.org/map/ami/781400_0066-115xx/mz_mit20x/|Map @ Mit20x]]
-  * [[http://siliconpr0n.org/map/ami/781400_0066-115xx/single/ami_781400_0066-115xx_mz_mit20x.jpg|Single]] (9466x12984, 43 MB)