Differences

This shows you the differences between two versions of the page.

--- infosecdj:philips:pcb83c652 [2025/06/10 14:23] – created - external edit 127.0.0.1
+++ infosecdj:philips:pcb83c652 [2025/08/04 21:23] (current) – external edit 127.0.0.1
@@ Line 1: / Line 1: @@
-{{tag>collection_infosecdj vendor_philips type_unknown year_unknown foundry_unknown}}
+{{tag>collection_infosecdj vendor_philips type_processor_microcontroller_8051 year_1986 foundry_unknown}}
+A 8051 derivative.
 ====== Package ======
@@ Line 7: / Line 8: @@
 <code>
+(Logo)
+PCB 80C652 P 008
+D8914V1 YS
+C652-4N-01
+(M)(C) INTEL 1980
+(M)(C) PHILIPS 1986
 </code>
-{{:infosecdj:philips:pcb83c652:pack_btm.jpg?300|}}
+====== Die ======
-<code>
+Die size: 5.06x7.52mm approx.
-</code>
+Bonding pad opening: 114 um, square.
-====== Die ======
+Metal pitch: 5.75 um.
+Poly pitch: 4.16 um.
+Poly width: 2.0 um.
+<code>
+V83C652V1
+VALVO
+(M)(C) INTEL 1980
+(M)(C) PHILIPS 1986
+</code>
 <code>
+AK CG HS
+JK HH HRK
+MR SR KK
+JM DH DT
+HB WS EZ
 </code>
-{{https://siliconpr0n.org/map/philips/pcb83c652/single/philips_pcb83c652_infosecdj_mz_nikpa20x.thumb.jpg}}
+{{https://siliconprawn.org/map/philips/pcb83c652/single/philips_pcb83c652_infosecdj_mz_nikpa20x.thumb.jpg}}
-[[https://siliconpr0n.org/map/philips/pcb83c652/infosecdj_mz_nikpa20x/|mz_nikpa20x]]
+[[https://siliconprawn.org/map/philips/pcb83c652/infosecdj_mz_nikpa20x/|Top metal imaged under a Nikon Plan Apo 20x/0.75]]
-  * [[https://siliconpr0n.org/map/philips/pcb83c652/single/philips_pcb83c652_infosecdj_mz_nikpa20x.jpg|Single]] (32559x48374, 368.37MiB)
+  * [[https://siliconprawn.org/map/philips/pcb83c652/single/philips_pcb83c652_infosecdj_mz_nikpa20x.jpg|Single]] (32559x48374, 368.37MiB)