Silicon Pr0n

User Tools

Site Tools

Trace: • k155id1
infosecdj:philips:pcb80c51bh

Differences

This shows you the differences between two versions of the page.

Link to this comparison view

Both sides previous revisionPrevious revision
Next revision		Previous revision
infosecdj:philips:pcb80c51bh [2025/06/16 17:54] – infosecdjinfosecdj:philips:pcb80c51bh [2025/06/29 17:25] (current) – infosecdj
Line 19: Line 19:
  
 ====== Die ====== ====== Die ======
 +
 +Die size: 3.3x3.4mm approx.
 +
 +Bonding pad opening: 84.8 um, square.
 +
 +Metal pitch: 4 um.
 +
 +Poly pitch: 2.86 um.
 +
 +Poly width: 1.3 um.
  
 <code> <code>
Line 38: Line 48:
  
   * [[https://siliconpr0n.org/map/philips/pcb80c51bh/single/philips_pcb80c51bh_infosecdj_mz_nikpa40x.jpg|Single]] (42745x43518, 443.734MiB)   * [[https://siliconpr0n.org/map/philips/pcb80c51bh/single/philips_pcb80c51bh_infosecdj_mz_nikpa40x.jpg|Single]] (42745x43518, 443.734MiB)
 +
 +{{https://siliconpr0n.org/map/philips/pcb80c51bh/single/philips_pcb80c51bh_infosecdj_mz_nikpa40x_s1.thumb.jpg}}
 +
 +[[https://siliconpr0n.org/map/philips/pcb80c51bh/infosecdj_mz_nikpa40x_s1/|ILD remains + poly imaged under a Nikon Plan Apo 40x/1.0 oil]]
 +
 +  * [[https://siliconpr0n.org/map/philips/pcb80c51bh/single/philips_pcb80c51bh_infosecdj_mz_nikpa40x_s1.jpg|Single]] (42773x43563, 351.664MiB)
 +
 +{{https://siliconpr0n.org/map/philips/pcb80c51bh/single/philips_pcb80c51bh_infosecdj_mz_nikpa40x_s2.thumb.jpg}}
 +
 +[[https://siliconpr0n.org/map/philips/pcb80c51bh/infosecdj_mz_nikpa40x_s2/|Poly imaged under a Nikon Plan Apo 40x/1.0 oil]]
 +
 +  * [[https://siliconpr0n.org/map/philips/pcb80c51bh/single/philips_pcb80c51bh_infosecdj_mz_nikpa40x_s2.jpg|Single]] (42351x43581, 287.697MiB)
  
infosecdj/philips/pcb80c51bh.1750096459.txt.gz · Last modified: 2025/06/16 17:54 by infosecdj