infosecdj:philips:pcb80c51bh
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| infosecdj:philips:pcb80c51bh [2025/06/07 20:09] – created - external edit 127.0.0.1 | infosecdj:philips:pcb80c51bh [2025/08/04 21:23] (current) – external edit 127.0.0.1 | ||
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| - | {{tag> | + | {{tag> | 
| + | A 8051 derivative. | ||
| ====== Package ====== | ====== Package ====== | ||
| Line 7: | Line 8: | ||
| < | < | ||
| + | TAIWAN | ||
| + | (Logo) | ||
| + | PCB 80C51BH-3 P J521 | ||
| + | 313060 | ||
| + | DSD9436V6 YU | ||
| + | V20810-M7002-B200 | ||
| + | (M)(C) INTEL 1980 | ||
| + | (M) PHILIPS 1989 | ||
| </ | </ | ||
| - | {{:infosecdj:philips:pcb80c51bh:pack_btm.jpg?300|}} | + | ====== Die ====== | 
| + | |||
| + | Die size: 3.3x3.4mm approx. | ||
| + | |||
| + | Bonding pad opening: 84.8 um, square. | ||
| + | |||
| + | Metal pitch: 4 um. | ||
| + | |||
| + | Poly pitch: 2.86 um. | ||
| + | |||
| + | Poly width: 1.3 um. | ||
| < | < | ||
| + | (M)(C) INTEL 1980 | ||
| + | (M) PHILIPS | ||
| </ | </ | ||
| - | + | < | |
| - | ====== Die ====== | + | V80C51BV6 | 
| + | </ | ||
| < | < | ||
| + | VALVO | ||
| </ | </ | ||
| - | {{https://siliconpr0n.org/ | + | {{https://siliconprawn.org/ | 
| + | |||
| + | [[https:// | ||
| + | |||
| + | * [[https:// | ||
| + | |||
| + | {{https:// | ||
| + | |||
| + | [[https:// | ||
| + | |||
| + | * [[https:// | ||
| + | |||
| + | {{https:// | ||
| - | [[https://siliconpr0n.org/ | + | [[https://siliconprawn.org/ | 
| - | * [[https://siliconpr0n.org/ | + | * [[https://siliconprawn.org/ | 
infosecdj/philips/pcb80c51bh.1749326969.txt.gz · Last modified: 2025/06/07 20:09 by 127.0.0.1
                
                